White light LED wafer packaging structure and packaging method

A chip packaging, white light technology, applied in electrical components, electric solid state devices, circuits, etc., can solve the problem of reducing the overall brightness of the product, and achieve the effect of reducing loss, improving light output, and solving the problem of light spots

Inactive Publication Date: 2016-03-23
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the white light wafer with vertical structure can solve the "yellow circle" phenomenon, its wafer uses a dark brown silicon carbide SiC or silicon Si substrate, which has a light absorption effect, thereby reducing the overall brightness of the product

Method used

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  • White light LED wafer packaging structure and packaging method

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Embodiment Construction

[0025] Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:

[0026] Such as figure 1 Shown is the LED packaging structure of the present invention, a schematic cross-sectional view of a specific embodiment, specifically including: a substrate 10 , a white LED chip 20 , a white silica gel layer 30 , gold wires 40 and a transparent silica gel layer 50 . The white LED chip is fixed on the substrate, the white silica gel layer is arranged on the side of the white LED chip, the white LED chip and the substrate are connected by gold wires, and the transparent silica gel layer is coated on the white LED chip and the white silica gel layer.

[0027] The substrate 10 is a ceramic substrate or a metal substrate with high thermal conductivity. The substrate 10 makes the LED packaging structure have good heat dissipation and stable and reliable quality.

[0028] The white LED chip 20 is a vertical structure chip. Usin...

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Abstract

The invention discloses a white light LED wafer packaging structure. The white light LED wafer packaging structure comprises a substrate, at least a white light LED wafer, a white silica gel layer and a transparent silica gel layer, wherein the white light LED wafer is fixed on the substrate; the white silica gel layer is arranged on the side face of the white light LED wafer; the white light LED wafer is connected with the substrate through a gold thread; and the white light LED wafer and the white silica gel layer are coated with the transparent silica gel layer. The invention also discloses a white light LED packaging method. The invention adopts the white light wafer with a perpendicular structure, so that the light spot problem of the light source is effectively solved; the substrate of the wafer is coated with the white silica gel layer, so that the light-absorbing phenomenon of the substrate material is effectively avoided; and meanwhile, the light loss in a secondary reflection process is reduced, so that the light out-coupling efficiency of the product is improved, and the luminance of the whole device is improved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a white LED chip packaging structure and packaging method. Background technique [0002] With the continuous development of LED technology, white LED light source devices are widely used in display LED backlight, lighting source and automotive lighting and other fields. [0003] The existing white light LED light source mainly adopts blue light LED chips to be coated with fluorescent glue around the periphery, and the blue light excites the phosphor powder to mix light to form white light. For products packaged by this process, due to the uneven excitation of the phosphor powder, the light color of the light source is uneven, and it is easy to form a "yellow circle" phenomenon of light spots. As customers have higher and higher requirements for light source quality, it is necessary to completely solve the "yellow circle" phenomenon of light spots. At present, the best solu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L2224/48091H01L2924/00014H01L33/48H01L33/52H01L2933/0033H01L2933/005
Inventor 蔡云峰
Owner JIANGSU WENRUN OPTOELECTRONICS
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