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MEMS device and preparation method thereof, electronic device

A technology of electronic devices and devices, which is applied in the field of MEMS devices and its preparation, can solve the problems of PR falling into the pixel area, deformation, and affecting the performance of MEMS products, so as to improve the yield rate and prevent damage

Active Publication Date: 2016-04-13
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, photoresist PR is usually used to bond the MEMS wafer and the top wafer in the process of image sensor preparation. During the bonding process, PR will be deformed after being squeezed by bonding (Bonding), and part of PR will fall to the pixel. area, which affects the performance of MEMS products

Method used

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  • MEMS device and preparation method thereof, electronic device
  • MEMS device and preparation method thereof, electronic device
  • MEMS device and preparation method thereof, electronic device

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0043]In order to solve the problems existing in the prior art, the present invention provides a kind of preparation method of MEMS device, below in conjunction with attached Figures 3a-3e The method is described further.

[0044] First, step 201 is executed to provide a MEMS wafer 301 on which a number of functional regions with a square structure spaced apart from each other are formed.

[0045] Specifically, such as Figure 3a As shown, the MEMS wafer 301 can be made of semiconductor materials such as silicon, polysilicon or SiGe, and is not limited to a certain one.

[0046] In the present invention, the MEMS device may be a graphic sensor, and the functional area in the graphic sensor is a pixel area, and the pixel area is particularly sensitive to particles and stains, so it needs to be guaranteed not to be polluted.

[0047] Wherein, the pixel regions are arranged at intervals, and their shape is a square structure, such as a square or a rectangle, and is not limited...

Embodiment 2

[0073] The present invention also provides a MEMS device, which is prepared by the method described in Example 1. In the MEMS device, although the adhesive will be deformed or broken during the bonding process, due to The top corner of the pixel area forms a protection area of ​​a blank area that is not covered by the adhesive, so the deformed adhesive will enter the protection area without polluting the pixel area, improving the Performance and yield of the MEMS device.

Embodiment 3

[0075] The present invention also provides an electronic device, including the MEMS device described in Embodiment 2. Wherein, the semiconductor device is the MEMS device described in Example 2, or the MEMS device obtained according to the preparation method described in Example 1.

[0076] The electronic device of this embodiment can be any electronic product or equipment such as mobile phone, tablet computer, notebook computer, netbook, game console, TV set, VCD, DVD, navigator, camera, video recorder, voice recorder, MP3, MP4, PSP, etc. , can also be any intermediate product including the MEMS device. The electronic device of the embodiment of the present invention has better performance due to the use of the above-mentioned MEMS device.

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Abstract

The invention relates to an MEMS device and a preparation method thereof, and an electronic device. The method comprises the steps of 1, providing an MEMS wafer, and forming a plurality of functions areas with point angles and spaced from one another on the MEMS wafer; 2, forming a patterning mask layer on the MEMS wafer to cover the function areas and areas around the point angles of the function areas; and 3, filling gaps in the mask layer with adhesive for bonding. The preparation method of the MEMS device has the advantages that 1, due to the pattern design, the MEMS pixel areas are prevented from being damaged; and 2, the product yield is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular, the invention relates to a MEMS device, a preparation method thereof, and an electronic device. Background technique [0002] For the increasing demand for high-capacity semiconductor storage devices, the integration density of these semiconductor storage devices has attracted people's attention. In order to increase the integration density of semiconductor storage devices, many different methods have been adopted in the prior art, such as by reducing the wafer size. And / or change the internal structure unit to form multiple memory units on a single wafer. For the method of increasing the integration density by changing the unit structure, attempts have been made to reduce the unit area. [0003] In the field of electronic consumption, multi-function devices are more and more popular among consumers. Compared with devices with simple functions, the production process of multi-functio...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81C3/00B81B7/02
Inventor 郑超冯霞李进
Owner SEMICON MFG INT (SHANGHAI) CORP