Stacked Chip Package Structure
A chip packaging structure and chip technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of large packaging area, limit the flexibility of electrodes on the chip, low integration, etc., and achieve the packaging structure area. Small, more flexible package design, high integration effect
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Embodiment 1
[0036] figure 1 It is a cross-sectional view of a stacked chip package structure according to Embodiment 1 of the present invention.
[0037] refer to figure 1 As shown, the stacked chip package structure 01 mainly includes a chip 11 , a chip 21 , a rewiring component 31 and a plastic package 41 .
[0038] Among them, the chip 11 and the chip 21 both include the opposite active surface and the back surface, and both the chip 11 and the chip 21 include devices that have been fabricated, such as diodes, metal oxide field effect transistors (MOSFETs), insulated gate bipolar Active devices such as transistors (IGBTs). The active devices in the general chip include various active regions formed in the chip and pads exposed on the active surface of the chip. Such pads are electrode pads of the active devices in the chip, and can also be directly become the input and output terminals of electrodes or chips, for example, at least some of the pads 111 located on the active surface o...
Embodiment 2
[0047] figure 2 It is a cross-sectional view of the stacked chip package structure according to the second embodiment of the present invention.
[0048] refer to figure 2 As shown, the stacked chip package structure 02 includes a chip 12 , a chip 22 , a redistribution component 32 and a plastic package 42 .
[0049] The chip 12 and the chip 22 are the same as in the first example, and the devices on the active surface of the chip 22 are electrically connected to the pads 121 on the active surface of the chip 12 through the conductive bumps 221 .
[0050] In this embodiment, the rewiring component 32 also includes a first component 321 , a second component 322 and a third component 323 . One end of the first component 321 is electrically connected to the pad 121, and the other end extends to the second component 322 in the first direction, and the second component 322 extends in the second direction to serve as a redistribution layer of the stacked chip package structure 01...
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