Two -way complementary electronic device substrate substrate anti -failure heat tube average temperature and heat dissipation device and method

Abstract

The invention discloses an anti-failure heat pipe temperature equilibrium and heat dissipation device and method for a substrate of a bidirectional compensation electronic device. The anti-failure heat pipe temperature equilibrium and heat dissipation device comprises condensation section heat dissipation fins, a heat dissipation substrate entity, a first heat pipe set and a second heat pipe set. According to the anti-failure heat pipe temperature equilibrium and heat dissipation device and method, surface heat sources which are distributed uniformly or non-uniformly can be loaded by an upper heat dissipation surface arrangement area and a lower heat dissipation surface arrangement area of the heat dissipation substrate, the heat pipe sets of bidirectional compensation structures are utilized, heat dissipation failure can be prevented under the variable working condition that different included angles are formed between nonuniform heat flow and the substrate as well as between the nonuniform heat flow and gravity, and temperature equilibrium control over the whole heat dissipation substrate is achieved; a condensation section is connected with the heat dissipation fins, heat can be dissipated through heat convection, overtemperature is prevented, and normal work of the electronic device is guaranteed.

Description

technical field [0001] The invention relates to a bidirectional complementary electronic device substrate failure prevention heat pipe uniform temperature heat dissipation device, which belongs to the technical field of heat dissipation of electronic devices under special conditions. Background technique [0002] The high frequency and high speed of electronic devices and the size of integrated circuits are getting smaller and smaller, which makes the heat generation of electronic components per unit volume increase sharply, and the failure rate of electronic devices increases exponentially with the increase of operating temperature. 55% of device operation errors are caused by overheating. In order to ensure work stability and prolong service life, the maximum temperature of the chip must not exceed 85°C. [0003] At present, there are many characteristics in the heat dissipation of electronic devices. It lacks enough heat dissipation space near the heat source; the heat so...

AI Technical Summary

Problems solved by technology

The traditional single heat pipe and flat heat pipe structure cannot well adapt to heat dissipation under variable working conditions, and other reasonable heat dissipation methods are needed to ensure the normal operation of electronic devices without overheating

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