Connection process for metal silver and tantalum not capable of being dissolved in each other in solid mode

A mutual insolubility and metallic silver technology, applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve problems such as uneven and discontinuous bonding interface, cumbersome process, etc.

Inactive Publication Date: 2016-05-04
MICCOOL YUEMEI TIANJIN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the process of realizing the present invention, the inventors found that the existing method of directly connecting two metals that ar...

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  • Connection process for metal silver and tantalum not capable of being dissolved in each other in solid mode
  • Connection process for metal silver and tantalum not capable of being dissolved in each other in solid mode
  • Connection process for metal silver and tantalum not capable of being dissolved in each other in solid mode

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Embodiment Construction

[0021] In order to further explain the technical means and effects that the present invention adopts to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation of the connection process of the mutually insoluble metal silver and tantalum proposed according to the present invention , structure, feature and effect thereof, detailed description is as follows.

[0022] The flow process of the connection process of the mutually insoluble metal silver and tantalum provided by this embodiment is as follows figure 1 shown.

[0023] figure 1 In, S100, pretreat the tantalum and silver to be connected.

[0024] Specifically, the tantalum in this embodiment can be in the shape of a plate, or in the shape of a long and thin rod (such as a round rod or a square rod, etc.) or block, and the silver can be in the shape of a plate or in the shape of a long and thin rod. Rod shape (such as round ...

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Abstract

The invention relates to a connection process for metal silver and tantalum not capable of being dissolved in each other in a solid mode. The connection process mainly includes the steps of preprocessing tantalum and silver which are to be connected, pressing a mixture of tantalum powder and silver powder into blanks with the thickness of 2-5 mm, stacking the blanks according to the sequence of tantalum, the blanks and silver, fixing tantalum, the blanks and silver which are stacked according to the sequence and applying pressure on tantalum, the blanks and silver so that to-be-connected faces of tantalum and to-be-connected faces of silver can be tightly attached to the blanks, and conducting annealing on fixed and pressurized tantalum, the fixed and pressurized blanks and fixed and pressurized silver, wherein the annealing temperature of annealing is lower than the melting point of silver by 10-50 DEG C. By means of the technical scheme, the process has the advantages of being simple, low in connection cost and the like, the bonding interfaces of metal silver and tantalum not capable of being dissolved in each other in the solid mode are uniform and continuous, and tantalum and silver not capable of being dissolved in each other in the solid mode can have good bonding strength.

Description

technical field [0001] The invention relates to a connection technology between metals, in particular to a connection technology of mutually insoluble metal silver and tantalum. Background technique [0002] With the rapid development of science and technology, people have higher and higher requirements for the performance of materials, because the performance of a single metal material sometimes cannot meet people's actual needs, and multi-phase metal materials have better performance in some application scenarios. Therefore, multi-phase metal materials have been widely used in many industries such as electronic technology industry, aerospace industry and automobile industry. [0003] Forming multiphase metallic materials sometimes involves joining between different metallic materials. When the two metal materials to be connected are in solid solution with each other, due to the good wetting and solid solution properties between the two metal materials in solid solution wi...

Claims

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Application Information

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IPC IPC(8): B23K20/02B23K20/233B23K20/24B23K20/16B23K103/18
CPCB23K20/02B23K20/16B23K20/233B23K20/24B23K2103/18
Inventor 郭江
Owner MICCOOL YUEMEI TIANJIN TECH CO LTD
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