Connection process for metal silver and tantalum not capable of being dissolved in each other in solid mode

Abstract

The invention relates to a connection process for metal silver and tantalum not capable of being dissolved in each other in a solid mode. The connection process mainly includes the steps of preprocessing tantalum and silver which are to be connected, pressing a mixture of tantalum powder and silver powder into blanks with the thickness of 2-5 mm, stacking the blanks according to the sequence of tantalum, the blanks and silver, fixing tantalum, the blanks and silver which are stacked according to the sequence and applying pressure on tantalum, the blanks and silver so that to-be-connected faces of tantalum and to-be-connected faces of silver can be tightly attached to the blanks, and conducting annealing on fixed and pressurized tantalum, the fixed and pressurized blanks and fixed and pressurized silver, wherein the annealing temperature of annealing is lower than the melting point of silver by 10-50 DEG C. By means of the technical scheme, the process has the advantages of being simple, low in connection cost and the like, the bonding interfaces of metal silver and tantalum not capable of being dissolved in each other in the solid mode are uniform and continuous, and tantalum and silver not capable of being dissolved in each other in the solid mode can have good bonding strength.

Description

technical field [0001] The invention relates to a connection technology between metals, in particular to a connection technology of mutually insoluble metal silver and tantalum. Background technique [0002] With the rapid development of science and technology, people have higher and higher requirements for the performance of materials, because the performance of a single metal material sometimes cannot meet people's actual needs, and multi-phase metal materials have better performance in some application scenarios. Therefore, multi-phase metal materials have been widely used in many industries such as electronic technology industry, aerospace industry and automobile industry. [0003] Forming multiphase metallic materials sometimes involves joining between different metallic materials. When the two metal materials to be connected are in solid solution with each other, due to the good wetting and solid solution properties between the two metal materials in solid solution wi...

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Problems solved by technology

[0006] However, in the process of realizing the present invention, the inventors found that the existing method of directly connecting two metals that are not solid-dissolving with each other has problems such as relatively cumbersome process and uneven and discontinuous bonding interface between the two metals.

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