Unlock instant, AI-driven research and patent intelligence for your innovation.

A cleaning agent used for removing a wafer glass mask packaging adhesive, preparation thereof and applications of the cleaning agent

A technology of cleaning agent and mask, applied in the direction of cleaning method using liquid, preparation of detergent mixture composition, detergent compounding agent, etc., to achieve the effect of less corrosion, low cost of use, and accelerated degumming speed

Active Publication Date: 2016-05-04
上海富乐德智能科技发展有限公司
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And up to the present, do not see relevant bibliographical information about this type of cleaning agent yet

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A cleaning agent used for removing a wafer glass mask packaging adhesive, preparation thereof and applications of the cleaning agent
  • A cleaning agent used for removing a wafer glass mask packaging adhesive, preparation thereof and applications of the cleaning agent
  • A cleaning agent used for removing a wafer glass mask packaging adhesive, preparation thereof and applications of the cleaning agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Take 25kg of acetone, 10kg of ethylene glycol ether, 20kg of dodecene, 20kg of ethylenediamine, 0.1kg of dodecylbenzenesulfonic acid, 24.9kg of purified water, stir at room temperature for 30min, and mix them into a 100kg wafer glass mask plate package Glue cleaner.

[0037] Under the condition of 60° C., use the encapsulation glue cleaning agent with the above composition to soak the wafer glass mask for 4 hours, so that the residual glue is dissolved with the assistance of the organic solvent component.

Embodiment 2

[0039] Take 20kg of acetone, 15kg of ethylene glycol ether, 15kg of dodecene, 25kg of ethylenediamine, 0.1kg of dodecylbenzenesulfonic acid, 24.9kg of purified water, stir at room temperature for 30min, and mix them into a 100kg wafer glass mask plate package Glue cleaner.

[0040] Under the condition of 70°C, soak the wafer glass mask for 4 hours with the encapsulation glue cleaning agent of the above composition, so that the residual glue is dissolved with the assistance of the organic solvent component.

Embodiment 3

[0042] Take 20kg of acetone, 10kg of ethylene glycol ether, 25kg of dodecene, 25kg of ethylenediamine, 0.1kg of dodecylbenzenesulfonic acid, 19.9kg of purified water, stir at room temperature for 30min, and mix them into a 100kg wafer glass mask plate package Glue cleaner.

[0043] Under the condition of 60°C, soak the wafer glass mask for 4 hours with the encapsulation cleaning agent of the above composition, so that the residual glue is dissolved with the assistance of the organic solvent component.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a cleaning agent used for removing a wafer glass mask packaging adhesive. The cleaning agent comprises 10-30 parts by weight of acetone, 3-15 parts by weight of glycol ether, 5-30 parts by weight of dodecylene, 5-30 parts by weight of ethylenediamine, 0.1-5 parts by weight of dodecylbenzene sulfonic acid and 10-30 parts by weight of purified water. The cleaning agent is prepared by stirring the acetone, the glycol ether, the dodecylene, the ethylenediamine, the dodecylbenzene sulfonic acid and the purified water at room temperature for 30 min to obtain the cleaning agent. The cleaning agent adopts a neutral organic solvent formula. A wafer glass mask adhesive residue part is dipped by utilizing an organic solvent so that the residue adhesive is rapidly separated from the surface of a mask with the assistance of the organic solvent component, and the adhesive removing speed is accelerated. The cleaning agent is low in corrosion to masks, low in using cost and mild in reaction conditions.

Description

technical field [0001] The invention belongs to the technical field of cleaning and removal of encapsulation glue, and in particular relates to a cleaning agent for removing encapsulation glue of a CMOS camera wafer glass mask plate and its preparation method and application. Background technique [0002] Cameras have been widely used in various electronic products, especially the rapid development of industries such as mobile phones and tablets, which has driven the rapid growth of the camera industry. At present, camera performance has become an important selling point of smartphones, and various manufacturers have continuously upgraded camera performance in new models to enhance product competitiveness. In 2012, the global market demand for CMOS sensors was 2.5 billion, and it is estimated that by 2017, the global demand for CMOS sensors will be 4.5 billion. [0003] However, during the packaging process of the CMOS sensor, the wafer glass mask will be contaminated with ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C11D1/24C11D3/60C11D3/44B08B3/08
CPCC11D1/24C11D3/184C11D3/2068C11D3/2072C11D3/30C11D3/43B08B3/08C11D2111/18
Inventor 何桥贺贤汉
Owner 上海富乐德智能科技发展有限公司