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Three-dimensional packaging device and three-dimensional packaging method aiming at MEMS

A technology of three-dimensional encapsulation and encapsulation, which is applied in the direction of microstructure devices, processing microstructure devices, and photolithography on patterned surfaces, etc. It can solve the problem of MEMS devices such as sensors and accelerometers that cannot be packaged, and the encapsulation area is large and reliable In order to improve the reliability and production efficiency, the structure of the device is simple, and the processing is precise.

Active Publication Date: 2016-05-18
昆山昆博智能感知产业技术研究院有限公司
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AI Technical Summary

Problems solved by technology

[0003] At present, the gold wire bonding system is mainly used in the wire bonding between the chip pad and the lead-frame between a plane. This packaging method is mainly carried out in a two-dimensional plane, and the formed line arc is a two-dimensional line arc, which meets the However, the existing three-dimensional packaging technologies, such as multi-chip packaging (MCP), stacked packaging (POP), and through-silicon via technology, can make microelectronic products miniaturized. However, there are still problems of large packaging area, difficult heat dissipation, poor reliability, and high cost, and cannot meet the packaging problems of MEMS devices such as sensors and accelerometers.

Method used

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  • Three-dimensional packaging device and three-dimensional packaging method aiming at MEMS
  • Three-dimensional packaging device and three-dimensional packaging method aiming at MEMS
  • Three-dimensional packaging device and three-dimensional packaging method aiming at MEMS

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Embodiment Construction

[0039] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0040] see Figure 1 to Figure 8 As shown, a MEMS-oriented three-dimensional packaging device includes five parts: a package positioning mechanism 1 , a rivet positioning mechanism 2 , a rivet assembly 3 , a wire feeding assembly 4 , and a microscopic vision assembly 5 .

[0041] see figure 1 , figure 2As shown, the package positioning mechanism 1 includes a first base 11, a mounting seat 14 that can be adjusted along the X, Y, and Z directions relative to the first base 11, and a rotating seat 15 for fixing and installing the package 6. The center line is distributed along the horizontal direction, and the rotating seat 15 is provided on the mounting seat 15 so as to rotate around the center line of the package body 6 . The package positioning mechanism 1 further includes a first driving mechanism for driving the...

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Abstract

The invention discloses a three-dimensional packaging device and a three-dimensional packaging method aiming at the MEMS. By adopting the three-dimensional packaging device and the three-dimensional packaging method aiming at the MEMS, different bonding points on different planes needing wire bonding of a packaged body can be conveniently positioned accurately, and choppers conveniently move to the bonding point positions to carry out wire bonding, so that a three-dimensional wire arc is formed on the packaged body, and the requirements for light-weight trend and miniaturization of microelectronics are met. The device is simple in structure, the operation is convenient, the processing is accurate, further reduction of the size and weight of the packaged body is facilitated, the reliability and production efficiency of the packaged body are improved, and the production cost of the packaged body is lowered.

Description

technical field [0001] The invention relates to a MEMS-oriented three-dimensional packaging device and a three-dimensional packaging method. Background technique [0002] In recent years, microelectronics technology has been involved in all aspects of modern life. With the continuous advancement of technology and market demand, the requirements of modern electronic products for light weight, miniaturization, low energy consumption, and high reliability continue to increase. Therefore, chip packaging (MCP ), package-on-package (POP), system-in-package (SIP) and other three-dimensional packaging technologies are emerging. In three-dimensional packaging, since single-chip packaging is replaced by three-dimensional devices, the size and weight of the package are significantly reduced. The reduction has a certain relationship with the process of vertical interconnection density, thermal performance, and required strength. [0003] At present, the gold wire bonding system is ma...

Claims

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Application Information

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IPC IPC(8): B81C3/00
CPCB81C3/004
Inventor 陈立国庄猛潘明强
Owner 昆山昆博智能感知产业技术研究院有限公司
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