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Method for plating indium on surface of Ti-Ni based memory alloy

A memory alloy, ti-ni technology, applied in the field of Ti-Ni-based memory alloy surface treatment, to achieve stable performance and simple process operation

Inactive Publication Date: 2016-05-25
有研科技集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at present, because the microhardness of the electroplated gold coating on the surface of the memory alloy is still about HV100, in some ultra-high sealing occasions, the surface of the memory alloy needs a metal coating with better plasticity and lower hardness

Method used

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  • Method for plating indium on surface of Ti-Ni based memory alloy
  • Method for plating indium on surface of Ti-Ni based memory alloy
  • Method for plating indium on surface of Ti-Ni based memory alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Take Ti 44 Ni 47 Nb 9 The memory alloy precision pipe joint has an inner diameter of 6mm and a length of 20mm. The pipe joint is a semi-finished workpiece after diameter expansion, and it is required to coat the inner pipe wall with an indium coating of about 5 μm at room temperature without temperature rise. The following process is used for indium plating: electric cleaning degreasing—acid etching activation—nickel plating primer—clean water rinse—indium plating layer.

[0026] The specific steps are:

[0027] The first step: electric net degreasing

[0028] The composition and process specifications of the electro-cleaning solution are:

[0029]

[0030] The relative movement speed of the electrodes is: 8m / min.

[0031] Temperature: room temperature.

[0032] Time: 60 seconds.

[0033] wash.

[0034] The second step: acid etching activation

[0035] The composition and process specifications of the activation solution are:

[0036]

[0037] The relat...

Embodiment 2

[0056] Take Ti 44 Ni 47 Nb 9 The memory alloy precision pipe joint has an inner diameter of 6mm and a length of 20mm. The pipe joint is a semi-finished workpiece after diameter expansion, and it is required to coat the inner pipe wall with an indium coating of about 20 μm at room temperature without temperature rise. The following process is used for indium plating: electric cleaning degreasing—acid etching activation—nickel plating primer—clean water rinse—indium plating layer.

[0057] The specific steps are:

[0058] The first step: electric net degreasing

[0059] The composition and process specifications of the electro-cleaning solution are:

[0060]

[0061] The relative movement speed of the electrodes is 8m / min.

[0062] Temperature: room temperature.

[0063] Time: 120 seconds.

[0064] Rinse off with clean water.

[0065] The second step: acid etching activation

[0066] The composition and process specifications of the activation solution are:

[0067] ...

Embodiment 3

[0086] Take Ti 44 Ni 47 Nb 9 The memory alloy aviation pipe joint has an inner diameter of 4mm and a length of 12mm. The pipe joint is a semi-finished workpiece after diameter expansion, and it is required to coat the inner pipe wall with an indium coating of about 10 μm at room temperature without temperature rise. The following process is used for indium plating: electric cleaning degreasing—acid etching activation—nickel plating primer—clean water rinse—indium plating layer.

[0087] The specific steps are:

[0088] The first step: electric net degreasing

[0089] The composition and process specifications of the electro-cleaning solution are:

[0090]

[0091] The relative movement speed of the electrodes is 4m / min.

[0092] Temperature: room temperature.

[0093] Time: 30 seconds.

[0094] wash.

[0095] The second step: acid etching activation

[0096] The composition and process specifications of the activation solution are:

[0097]

[0098] The relati...

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Abstract

The invention relates to a method for plating indium on surface of a Ti-Ni based memory alloy, which belongs to the technical field of surface treatment for the Ti-Ni based memory alloy. The method comprises the following steps: (1) polishing workpieces of Ti-Ni based memory alloy, derusting, performing electrocleaning treatment; (2) performing activation treatment; and (3) plating Ni to obtain the Ti-Ni based memory alloy, and 4) plating indium to obtain the Ti-Ni based memory alloy. The method of the invention is performed at room temperature and the temperature is not obviously increased during the treatment process, thus the demands of some memory alloy finished products on temperature can be satisfied. The method for plating indium on surface of a Ti-Ni based memory alloy has simple operation, stable performance, and long coating hardness, thus coating hardness requirement of high seal connection of certain pipeline can be satisfied.

Description

technical field [0001] The invention relates to a method for plating indium on the surface of a Ti-Ni-based memory alloy, through which an indium coating with good binding force is obtained by plating on the surface of the Ti-Ni-based memory alloy, and belongs to the technical field of surface treatment of the Ti-Ni-based memory alloy. Background technique [0002] Shape memory alloys are smart metals represented by equiatomic ratio TiNi alloys, which have unique shape memory properties. The shape memory effect is a special property that the alloy returns to its original shape when it is heated above a certain critical temperature after being deformed at a low temperature. A variety of driving and actuator components have been prepared in engineering using the characteristics of shape memory alloy materials, which have been widely used in the machinery and automation industries; among them, shape memory alloy pipe joints are a typical representative, and the principle is to ...

Claims

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Application Information

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IPC IPC(8): C25D5/12
Inventor 尹向前米绪军高宝东李艳锋冯雪解浩峰
Owner 有研科技集团有限公司