Device for transition from rectangular waveguide to substrate integrated waveguide on Ka-band

Abstract

The invention discloses a device for transition from a rectangular waveguide to a substrate integrated waveguide on a Ka-band. The device comprises the rectangular waveguide, a first resonant cavity, the substrate integrated waveguide and a second resonant cavity, which are sequentially arranged from bottom to top, wherein the substrate integrated waveguide comprises a dielectric substrate, an upper metal sheet and a lower metal sheet; the upper metal sheet and the lower metal sheet are arranged on the upper surface and the lower surface of the dielectric substrate; a first coupling window is formed in the position, corresponding to a rectangular waveguide opening, of the lower metal sheet; and a second coupling window is formed in the position, corresponding to the second resonant cavity, of the upper metal sheet. The device has the advantages of small volume, small insertion loss and large bandwidth, and is suitable for application of right-angle transition of the Ka-band broadband, simple in structure, easy to fabricate and worthy of industry promotion; and mass production is achieved.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave integration, and in particular relates to a device for converting a Ka-band rectangular waveguide into a substrate integrated waveguide. Background technique [0002] Substrate Integrated Waveguide (Substrate Integrated Waveguide) is a new type of waveguide structure proposed in recent years. It is composed of two rows of metallized through holes on the left and right, two layers of metal surfaces on the upper and lower sides, and a low-loss dielectric layer filled in the middle. Transmission properties of waveguides. It has the advantages of low loss, high Q value, low cost, and easy integration, which solves the problem that traditional metal waveguides are difficult to integrate and miniaturize. Since the entire structure is completely composed of metal via arrays on the dielectric substrate, multi-layer printing can be used Circuit board (PCB) or low temperature co-fired...

AI Technical Summary

Problems solved by technology

These transition structures are difficult to meet the volume, bandwidth, insertion loss and other requirements at the same time. For example, the tapered fin-line transition structure has a large circuit size, and the ridge-shaped stepped waveguide transition structure has a large insertion loss and is not easy to process.

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