Mobile terminal

A technology for mobile terminals and heating elements, which is applied in cooling/ventilation/heating transformation, electrical components, and structural parts of electrical equipment. Automated operation, improved heat dissipation performance, and labor cost savings

Inactive Publication Date: 2016-05-25
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat-conducting silicone pad is a molded product with poor plasticity. The heat-conducting gap around the heating element cannot be filled, and for the heating element with irregular shape, it cannot completely cover the heating element, and the heat transfer efficiency of the air in the heat-conducting gap is relatively low. , the temperature around the heating element is still relatively high, which reduces the working efficiency of the heating element

Method used

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Experimental program
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Effect test

Embodiment 1

[0016] figure 1 It is a schematic structural diagram of the heat dissipation part in the mobile terminal provided by Embodiment 1 of the present invention. The heat conduction gap around the heating element in the mobile terminal can be effectively filled with heat conduction gel, which improves the heat generation performance of the heat generating element. Wherein, the mobile terminal may be a smart phone, a tablet computer, or a personal digital assistant. Such as figure 1 As shown, the mobile terminal includes a printed circuit board 1, a first heating element 2 arranged on the printed circuit board 1, and a first thermally conductive gel 3 covering the first heating element 2, the first thermally conductive gel 3 is used for filling The thermal conduction gap of the first heating element 2 .

[0017] Among them, the thermally conductive gel has the characteristics of high thermal conductivity, low thermal resistance, good conformability, insulation, can automatically f...

Embodiment 2

[0026] figure 2 It is a schematic structural diagram of the heat dissipation part in the mobile terminal provided by Embodiment 2 of the present invention. The difference between this embodiment and the first embodiment is that it further includes a middle frame disposed above the first shielding cover. Such as figure 2 As shown, the mobile terminal of this embodiment may include a printed circuit board 1, a first heating element 2 arranged on the printed circuit board 1, a first thermally conductive gel 3 covering the first heating element 2, and a first heating element 3 arranged on the first heating element 2. The first shielding cover 4 on the periphery of the element 2 and the middle frame 5 arranged above the first shielding cover 4 are used to diffuse the heat transmitted from the first heating element 2 to the middle frame 5, so as to prevent the front screen of the mobile terminal from absorbing More heat causes the screen temperature of the mobile terminal to be ...

Embodiment 3

[0034] image 3 It is a schematic structural diagram of the heat dissipation part in the mobile terminal provided by the third embodiment of the present invention. The difference between this embodiment and Embodiment 1 is that the first heating element is arranged on the first surface of the printed circuit board, and the second surface of the printed circuit board corresponds to the position of the first heating element with a third thermally conductive gel . Such as image 3 As shown, the mobile terminal of this embodiment may include a printed circuit board 1, a first heating element 2 arranged on the first surface of the printed circuit board 1, a first heat-conducting gel 3 covering the first heating element 2, and a The first shielding cover 4 on the periphery of the first heating element 2, the middle frame 5 arranged above the first shielding cover 4, and the third heat conduction gel glued to the second surface of the printed circuit board 1 corresponding to the fi...

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PUM

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Abstract

The invention discloses a mobile terminal, which comprises a printed circuit board, a first heating element and a first heat-conducting gel, wherein the first heating element is arranged on the printed circuit board; the first heat-conducting gel coats the first heat-conducting element; and the first heat-conducting gel is used for filling a heat-conducting gap of the first heating element. The mobile terminal improves the heat dissipation performance of the heating element.

Description

technical field [0001] The present invention relates to the technical field of mobile communication equipment, in particular to a mobile terminal. Background technique [0002] The intelligentization of mobile terminals has driven the rapid upgrading of its various links. The central processing unit (Central Processing Unit, CPU) has changed from single-core to dual-core, quad-core, and then to the current hot eight-core; in order to improve image processing capabilities, the performance of the Graphics Processing Unit (GPU) has also been rapidly improved; at the same time, Various games based on mobile terminals are also becoming more and more complex, with higher and higher playability, and higher and higher requirements for the processing performance of the system. However, as the performance of mobile terminals has been greatly improved, the power consumption of mobile terminals is also increasing, and the increase in power consumption will inevitably bring about heatin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20463
Inventor 李明亮孙禄
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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