Lead-free and halogen-free roll coating solder paste and preparation method thereof

A roll-coating and solder paste technology, which is applied in the field of lead-free and halogen-free roll-coating solder paste and its preparation, can solve the problems of poor oxidation resistance of solder paste, inability to keep wet for a long time, re-oxidation without protection, etc. Uniform and smooth hole welding process, excellent printing and forming effect, and good repeatable printing effect

Active Publication Date: 2016-06-01
DONGGUAN XIANFEI ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1) The formula contains organic acid, which will cause the organic acid to react with the tin powder during the long-term printing process of the solder paste, which will accelerate the oxidation of the tin powder and eventually lead to soldering failure;
[0007] 2) The thixotropy of the solder paste is too poor or the viscosity of the solder paste recovers too slowly after shearing, resulting in under-soldered phenomenon;
[0008] 3) Solder paste is prone to brok

Method used

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  • Lead-free and halogen-free roll coating solder paste and preparation method thereof
  • Lead-free and halogen-free roll coating solder paste and preparation method thereof
  • Lead-free and halogen-free roll coating solder paste and preparation method thereof

Examples

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Example Embodiment

[0049] Example 1

[0050] Add 4.5 g of ethylene glycol ethyl ether and 5 g of modified hydrogenated rosin to the mixing reaction kettle, and preheat it at 80°C for 5-15 minutes; raise the temperature to 150°C, heat and stir until it is completely dissolved to obtain a mixed solution. When the solution is cooled to 80°C, add 0.8 g of DL-malic acid, 0.6 g of hydrogenated castor oil and 0.8 g of hydroquinone and stir well, then let it cool to 52°C, and continue to add 0.5 g of octylphenol-10, 1 Gram propylene glycol, 1 gram of naltrexone, stir evenly, let stand, cool to room temperature to get the soldering paste, add the prepared soldering paste to the grinder, seal it after grinding and put it in a refrigerator at 0~10℃ for refrigeration After 12h, warm to room temperature, take 14g solder paste and 86g Sn 89.5 Sb 10 Ni 0.5 Stir evenly in a mixing barrel, prepare lead-free halogen-free roll-coating solder paste by vacuum degassing, and then divide it into cans or syringes accordin...

Example Embodiment

[0051] Example 2

[0052] Add 4 grams of ethylene glycol phenyl ether and 4 grams of fully hydrogenated rosin to the mixing reaction kettle, and preheat it at 90°C for 5-15 minutes; raise the temperature to 170°C, heat and stir until it is completely dissolved to obtain a mixed solution. When the solution is cooled to 80°C, add 0.7g of sebacic acid, 0.7g of polyamide sodium and 0.6g of ethylene glycol benzoxazole and stir well, then let it cool to 52°C, continue to add 1.0g of monoisooctyl phosphate and 0.5g Glycerol, 0.5 g of naloxone, stir evenly, let stand, cool to room temperature to obtain the soldering paste, add the prepared soldering paste to the grinder, seal it after grinding, and put it in a refrigerator at 0~10℃ After refrigerating for 12 hours, return to room temperature, take 12 grams of solder paste and 88 grams of Sn 90 Bi 8.5 Ag 1.5 Stir evenly in a mixing barrel, prepare lead-free halogen-free roll-coating solder paste by vacuum degassing, and then divide it int...

Example Embodiment

[0053] Example 3

[0054] Add 2.7 grams of ethylene glycol and 3.2 grams of fully hydrogenated rosin to the mixing reaction kettle, and preheat it at 80°C for 5-15 minutes; raise the temperature to 150°C, heat and stir until it is completely dissolved to prepare a mixed solution. When the mixed solution is cooled When it reaches 80℃, add 0.5g of citric acid, 0.4g of polyamide sodium and 0.1g of benzotriazole and stir well, then let it cool to 50℃, continue to add 0.1g of phenyl glycidyl ether and 0.5g of glycerol , 0.5g of naloxone, stir evenly, let it stand, cool to room temperature to get the soldering paste, add the prepared soldering paste to the grinder, seal it after grinding and put it in a refrigerator at 0~10℃ for 12h. , Warm to room temperature, take 8 grams of flux paste and 92 grams of Sn 90 Bi 10 Stir evenly in a mixing barrel, prepare lead-free halogen-free roll-coating solder paste by vacuum degassing, and then divide it into cans or syringes according to the requi...

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Abstract

The invention relates to the technical field of solder paste, in particular to lead-free and halogen-free roll coating solder paste and a preparation method thereof. The lead-free and halogen-free roll coating solder paste comprises, by weight percentage, 82-92% of allow solder powder, 2.7-6.0% of organic solvents, 3.2-5.4% of film-forming agents, 0.5-1.8% of organic acid, 0.4-1.5% of thixotropic agents, 0.1-1.5% of surface active agents, 0.1-1.6% of preservatives, 0.5-2.0% of humectants and 0.5-2.0% of slow release agents. The lead-free and halogen-free roll coating solder paste has the advantages of being good in oxidation resistance, good in welding effect, capable of avoiding crusting during low-temperature storage, and capable of being kept wet for a long time without being dry.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a lead-free and halogen-free roll coating solder paste and a preparation method thereof. Background technique [0002] Solder paste, mainly used in the soldering of electronic components and printed circuit board pads, is a kind of soldering material that emerged with surface mount technology (SMT). SMT refers to printing on printed circuit board pads, Apply solder paste, and place surface mount components accurately on the pads coated with solder paste, heat the circuit board according to a specific reflow temperature curve, let the solder paste melt, and its alloy components are cooled and solidified on the components The technology of forming solder joints with printed circuit boards to realize metallurgical connections. [0003] With the rapid development of electronic technology, the integration of electronics is becoming more and more prominent, and the requirements f...

Claims

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Application Information

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IPC IPC(8): B23K35/22B23K35/363B23K35/40B23K101/42
CPCB23K35/22B23K35/362B23K35/40B23K2101/42
Inventor 轩飞
Owner DONGGUAN XIANFEI ELECTRONICS MATERIAL CO LTD
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