Three-dimensional forming device and method

Abstract

The invention discloses a three-dimensional forming device based on a base layer. The three-dimensional forming device comprises the base layer, a base material forming mechanism, an exposure mechanism, a supporting mechanism and a stripping mechanism. The base material forming mechanism comprises a separating liquid jetting device and a containing groove used for containing a photosensitive material. The separating liquid jetting device jets separating liquid to the lower surface of the base layer so that a separated type coating can be formed; afterwards, coating of a photosensitive material layer is conducted; and the base layer, the separated type coating and the photosensitive material layer are sequentially formed to form a base material. The base material is repeatedly and sequentially transferred to the base material forming mechanism, the supporting mechanism and the stripping mechanism, the corresponding positions of the base material forming mechanism, the exposure mechanism and the stripping mechanism are controlled, two or three steps of base material forming, exposure and stripping can be conducted at the same time through the three-dimensional forming device, and the actions of base material forming, exposure and stripping are conducted repeatedly at the same time. The working efficiency is improved, and the three-dimensional forming device is suitable for meeting the manufacturing requirements of three-dimensional entities for the large range, high efficiency, high precision, low cost and the like.

Description

technical field [0001] The invention relates to the technical field of photocuring molding, in particular to a three-dimensional object molding device and method. Background technique [0002] Layered superposition is the main implementation method of 3D modeling technology at present. Its principle is simple, its structure is reliable, and its data processing method is mature, so it has been widely used. The superposition between layers is based on different physical and chemical materials and methods, such as glue bonding, hot-melt lamination, laser sintering and photopolymerization. Among them, the photopolymerization method is based on the principle of photochemical reaction, without mechanical force and heating process, and has the highest molding precision. [0003] A typical material for photopolymerization is a photosensitive curable resin, which is a liquid suspension of short molecular chains before polymerization. When irradiated by electromagnetic radiation of a...

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Problems solved by technology

[0005] There are two main limitations of the above method. One is the large consumption of resin, because the height of the moldable parts depends on the depth of the resin liquid, which requires a large amount of resin to be stored in the liquid tank, and these unused resins are prone to premature failure. Photosensitive curing, while exposure to air can easily lead to deterioration, resulting in unnecessary material loss

Second, the molding speed is slow, because the photosensitive resin often has a large viscosity, its self-leveling speed is slow, and the surface accuracy after leveling is difficult to control

When processing parts with closed cavity, it is easy to make unnecessary resin liquid be closed or remain inside the part, which will affect the final molding accuracy of the part

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