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Copper/graphene composite multi-layer heat dissipation film

A graphene composite and graphene layer technology, applied in cooling/ventilation/heating transformation, electrolytic inorganic material coating, modification through conduction heat transfer, etc., can solve the problems of limited heat dissipation direction and low heat dissipation efficiency of heat dissipation film, etc. Achieve the effect of improved heat dissipation efficiency and tight connection

Inactive Publication Date: 2016-06-01
河北迪曼新能源科技有限公司
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Problems solved by technology

[0005] The invention aims to solve the disadvantages of low heat dissipation efficiency and limited heat dissipation direction of the existing heat dissipation film, and provides a copper / graphene composite multilayer heat dissipation film and its preparation method

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  • Copper/graphene composite multi-layer heat dissipation film

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Embodiment Construction

[0024] The specific embodiment of the present invention will now be described in detail in conjunction with the accompanying drawings.

[0025] The copper / graphene composite multilayer heat dissipation film of the present invention is mainly composed of graphene layers 1 and copper layers 2 alternately stacked. Wherein, the number of layers of the graphene layer and the copper layer can be set according to the requirements of large-area industrial use of electronic equipment. In the present invention, the surface layer of the copper / graphene composite multilayer heat dissipation film is preferably a graphene layer , the middle layer is formed by alternately stacking copper layers and graphene layers, and its total thickness is 10-50 μm.

[0026] The preparation method of the copper / graphene composite multilayer heat dissipation film of the present invention mainly comprises the following steps: Step 1, take a piece of metal substrate, chemical degreasing; Step 2, deposit a lay...

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Abstract

The invention discloses a copper / graphene composite multi-layer heat dissipation film and a preparation method thereof. The heat dissipation film is formed by alternately superposing a graphene layer and a copper layer. The preparation method mainly comprises the following steps: sequentially coating a graphene film and copper on a metal matrix; and finally, dissolving the metal matrix to obtain the self-supported copper / graphene composite multi-layer heat dissipation film. The heat dissipation film prepared by the method is high in heat dissipation efficiency, and is convenient to use.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation materials, in particular to a copper / graphene composite multilayer heat dissipation film and a preparation method thereof. Background technique [0002] With the development of large-scale integrated circuits and packaging technology, electronic products are also developing in the direction of thinner, lighter and smaller, making the surface temperature of electronic products is also rising, and components also urgently need a relatively low temperature environment to operate reliably. Otherwise, the life of electronic components will be reduced, so the heat dissipation of electronic products has become a very prominent problem. [0003] At present, some products in the market use metals for heat conduction and heat dissipation, especially copper and aluminum. Although the thermal conductivity of copper is (398W / mK), its heavy weight and easy oxidation limit its application, while the the...

Claims

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Application Information

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IPC IPC(8): C25D5/10C25D3/38C25D9/08H05K7/20
CPCC25D3/38C25D5/10C25D9/08H05K7/2039
Inventor 刘丽蓉
Owner 河北迪曼新能源科技有限公司
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