Method and system for evaluating chip surface topography after chemical mechanical polishing

Abstract

The present invention discloses a method and a system for evaluating surface appearance of a chip after chemical mechanical polishing, belonging to the technical field of integrated circuit manufacture. The method comprises the steps of: acquiring surface appearance parameters and a grinding fluid selection ratio of a chip in the previous process stage; acquiring process parameters and a grinding fluid selection ratio in the current process stage; dividing a current surface layout of the chip into a plurality of continuous panes, respectively extracting layout characteristic parameters of each pane; judging whether the grinding fluid selection ratio changes, if the grinding fluid selection ratio changes, calculating surface appearance parameters of the chip in the current process stage according to the surface appearance parameters in the previous process stage, the process parameters, the layout characteristic parameters and the grinding fluid selection ratio in the current process stage; and evaluating the surface appearance of the chip according to the surface appearance parameters in the current process stage. The method of the invention can accurately evaluate the surface appearance of a chip.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a method and system for evaluating chip surface topography after chemical mechanical polishing. Background technique [0002] In the manufacturing process of integrated circuits (Integrated Circuit, referred to as IC), metals, dielectrics and other materials are applied to the surface of silicon wafers by various methods such as physical vapor deposition and chemical vapor deposition to form layered metal structure. Integrated circuits usually include a multi-layer metal structure, and each layer of metal is connected with a plurality of metal-filled vias. The metal structure can connect the layers of the circuit, making the integrated circuit very complex and circuit density. Therefore, a critical step in the fabrication of integrated circuits lies in the formation of metal structures. [0003] The flatness of the surface of the metal layer will affec...

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Problems solved by technology

[0011] Due to the complexity of the chemical mechanical polishing process, it can be divided into multiple process stages. In different process stages, different abrasive liquids need to be selected for grinding and polishing, and different abrasive liquids have different removal rates for different materials. Causes a change in the selectivity ratio of the slurry

The above evaluation method can accurately evaluate the surface topography of the chip after chemical mechanical polishing when the selection ratio of the polishing liquid remains unchanged, but when the selection ratio of the polishing liquid changes, the surface topography of the chip will The appearance changes, which makes it impossible to accurately evaluate the surface topography of the chip

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