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Electroplating clamp compatible with single wafers of multiple sizes

An electroplating fixture and multi-size technology, applied in the electrolytic process, electrolytic components and other directions, can solve the problems of easy fragmentation, complex fixing mode of a single wafer, poor uniformity, etc., and achieve the effect of low electroplating manufacturing cost.

Active Publication Date: 2016-06-08
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional electroplating fixture is only designed for a single size. The electroplating fixture needs to be replaced for different size wafers, and the traditional single wafer fixing mode is more complicated, easy to fragment, and the uniformity is not good

Method used

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  • Electroplating clamp compatible with single wafers of multiple sizes
  • Electroplating clamp compatible with single wafers of multiple sizes
  • Electroplating clamp compatible with single wafers of multiple sizes

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Experimental program
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Embodiment Construction

[0029] The technical solutions of the present invention will be further clearly and completely described below in conjunction with the accompanying drawings and embodiments.

[0030] refer to Figure 1-Figure 4 , a multi-size compatible wafer monolithic electroplating jig involved in this embodiment includes:

[0031] A substrate 1, which is provided with a plurality of circular grooves 3 of different sizes for respectively accommodating wafers of different sizes, and these grooves are arranged concentrically;

[0032] And, a probe mechanism for pressing and fixing the wafer in the groove and electrically contacting the wafer.

[0033] Further, there are multiple probe mechanisms, which are arranged around the groove, especially distributed symmetrically around the groove.

[0034] Further, the probe mechanism includes a probe 5, one end of the probe is rotatably connected to the base 1, and the other end is a movable end that cooperates with the wafer.

[0035] Further, th...

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PUM

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Abstract

The invention discloses an electroplating clamp compatible with single wafers of multiple sizes. The electroplating clamp comprises a base body and multiple probe mechanisms, wherein the base body is provided with multiple grooves of different sizes, and the grooves are used for containing the wafers of different sizes and arranged concentrically; the probe mechanisms are used for pressing and fixing the wafers into the grooves and make electrical contact with the wafers. Furthermore, the multiple probe mechanisms surround the grooves. Each probe mechanism comprises a probe with one end rotationally connected to the base body and the other end serving as a movable end matched with the wafers. The electroplating clamp has the advantages of being simple in structure, easy to manufacture, convenient and safe to operate, good in uniformity, not prone to being damaged or crashed, good in universality and the like, and is particularly applicable to electroplating of semiconductor single wafers.

Description

technical field [0001] The invention relates to an electroplating jig, in particular to a multi-size compatible single wafer electroplating jig, which belongs to the field of semiconductor chip manufacturing. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of some conductive materials using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts. [0003] The electroplating fixture is a tool for fixing the material to be plated during the electroplating process, and its design is crucial to the quality of the plating layer. The traditional electroplating fixture is only designed for a single size. The electroplating fixture needs to be replaced for different sizes of wafers, and the traditional single wafer fixing mode is more complicated, easy to fragment, and the uniformity is not good. Contents of the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/06
Inventor 俞挺张学敏丁海舰
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI