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An improved equipment for p5000 machine bpsg process

A machine and equipment technology, applied in the field of equipment improvement of BPSG process, can solve the problems of small design space of HOTBOX, out-of-service support for TEOS doping-related configuration parts, and difficulty in replacement and maintenance of pipe and valve parts, so as to achieve cost saving and high efficiency. Effect of liquid source supply device

Active Publication Date: 2019-11-05
苏州工业园区纳米产业技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The factory has discontinued the production of this type of machine for many years, and the spare parts related to TEOS doping have also ceased service support;
[0006] 2. The design space of the original HOTBOX is small, and it is difficult to replace and maintain the internal pipe valves;
[0007] 3. The replacement of doped liquid source Ampule is time-consuming and laborious

Method used

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  • An improved equipment for p5000 machine bpsg process
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  • An improved equipment for p5000 machine bpsg process

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Embodiment

[0027] Embodiment: A kind of improved equipment of P5000 machine BPSG technology, comprises P5000 machine body 1 and two independent cabinets 2, the top of described P5000 machine body is installed with TEOS pipeline 3, the inside of described cabinet A small set of cabinets 4 is installed, and the small set of cabinets is a two-layer structure. The lower layer of the small set of cabinets is placed to store a steel cylinder 5 with a liquid source, and the upper layer is equipped with a liquid source output pipeline system 6. The liquid source output The pipeline system communicates with the steel cylinder, and also includes a liquid source lead-out pipeline 7, the liquid source lead-out pipeline is installed above the cabinet, one end of the liquid source lead-out pipeline is connected to the liquid source output The pipeline system is connected, and the other end is docked with the TEOS pipeline. A heater 8 is installed on the lower layer of the small cabinet, the steel cylin...

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Abstract

The invention discloses equipment improvement for a P5000 machine BPSG process. The invention involves a P5000 machine body and two independent cabinets. A TEOS pipeline is installed above the P5000 machine body, the cabinets are internally equipped with a cabinet set having a vertical two-layer structure respectively, a liquid source stored steel cylinder is placed at the lower layer, the upper layer is equipped with a liquid source output pipeline system, and the liquid source output pipeline system is communicated with the steel cylinder. The invention also involves liquid source extraction pipelines mounted above the cabinets, one ends of the liquid source extraction pipelines are connected to the liquid source output pipeline system and the other ends are in butt joint with the TEOS pipeline, a heater is mounted at the lower layer of each cabinet set, the steel cylinder is placed in the heater, the liquid source extraction pipelines are wrapped by a heating tape, the cabinets are internally provided with a controller respectively, the controllers are in communication connection with the P5000 machine body, and the controllers control the operation of the heaters and the heating tapes. The equipment improvement can realize the BPSG process, also saves cost, and can achieve simple, reliable and efficient replacement of liquid sources.

Description

technical field [0001] The invention relates to an equipment improvement for a BPSG process, in particular to an improved equipment for a P5000 machine BPSG process. Background technique [0002] At present, the BPSG process at home and abroad has become a common process. The full name of BPSG is borophosphosilicate glass, that is, silicon dioxide doped with boron and phosphorus. As the first layer pre-metal dielectric and inter-metal dielectric, it has been widely used in IC manufacturing. BPSG film has excellent hole filling ability and can improve the planarization of the entire silicon wafer surface, thus providing a larger process range for lithography and subsequent processes. The BPSG process is mainly realized by PECVD machines in the industry. The typical one is the P5000 machine produced by Applied Materials in the early days. Since this machine was designed in the 1980s, the hot box (HOTBOX) of the machine has a small space and is used for storage. The ampule (A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B19/14H01L21/67
CPCC03B19/1415C03B2201/10C03B2201/28H01L21/67011
Inventor 时文礼王剑杨亮李文涛
Owner 苏州工业园区纳米产业技术研究院有限公司
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