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Device for automatically detecting two-dimensional morphology of wafer substrate

An automatic detection and chip technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve problems affecting consistency, system error, and complex structure of light-passing devices, and achieve simple structure, consistency assurance, and high coating accuracy Effect

Active Publication Date: 2016-06-22
北京艾瑞豪泰信息技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the relatively complex structure of the light-passing device and its own system error, it is difficult to ensure the consistency of the light received by each PSD
In addition, in this device, the light beams in each direction have their own reflection and transmission elements on the optical path, which further affects the consistency of the light received by each PSD

Method used

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  • Device for automatically detecting two-dimensional morphology of wafer substrate
  • Device for automatically detecting two-dimensional morphology of wafer substrate
  • Device for automatically detecting two-dimensional morphology of wafer substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] For ease of understanding, Embodiment 1 of the present invention only provides one of the light beams in the first direction and the light beam in the second direction.

[0025] See attached figure 1 The device for automatically detecting the two-dimensional topography of the wafer substrate provided by the present invention includes N PSDs 1 or 1', N beams of the first type of laser light, and N first beam splitters 4 or 4 corresponding to the N beams of the first type of laser light one-to-one. ', N second beam splitters 14 or 14' corresponding to the N beams of the first laser one-to-one, the first computing module, the second computing module and the analysis module, the N beams of laser light are arranged along a straight line, wherein N is 3 The above natural numbers, N PSD1 or 1' correspond to N beams of lasers one by one, and N PSD1 or 1' are respectively arranged on the left and right sides of N beams of lasers, including left PSD1' and right PSD1;

[0026] Ea...

Embodiment 2

[0062] See attached figure 2 The difference from the device for automatically detecting the two-dimensional topography of the wafer substrate provided in Embodiment 1 of the present invention is that in the device for automatically detecting the two-dimensional topography of the wafer substrate provided in the embodiment of the present invention, the N beams of lasers are used one by one The corresponding N first beam splitters 4 or 4' and / or the N second beam splitters 14 or 14' corresponding to the N beams of laser light are respectively integrated into one piece, and figure 2 Among them, N first light splitters are integrated into one piece, and the label is 21, and N second light splitters are integrated into one piece, and the number is 22; corresponding to the area of ​​the light beam in the first direction, the coating of the first light splitter 21 makes it in ( The reflectance in the wavelength range of λ-10nm, λ+10nm) is 50%, corresponding to the area of ​​the ligh...

Embodiment 3

[0069] See attached image 3 And attached Figure 7 , the difference from the device for automatically detecting the two-dimensional topography of the wafer substrate provided in the second embodiment of the present invention is that in the device for automatically detecting the two-dimensional topography of the wafer substrate provided in the third embodiment of the present invention, the N beams of laser light are composed of a plurality of issued by the laser emitting device.

[0070]The multi-channel laser emitting device includes a multi-channel beam splitting prism 37 and a laser 36. The multi-channel beam splitting prism 37 includes a plurality of beam-splitting surfaces parallel to each other, and the included angle α between the multiple beam-splitting surfaces and the horizontal direction is 45° respectively. The centers of the multiple beam-splitting surfaces are on the same straight line, and the laser light emitted by the laser 36 is directed to one of the outerm...

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Abstract

Disclosed is a device for automatically detecting the two-dimensional morphology of a wafer substrate. Through a first operation module and a second operation module of the device, the curvature CX of any two incident points on a wafer substrate in the radial direction of a to-be-detected substrate (namely, the X direction) and the curvature CY of any one incident point on the wafer substrate in the moving direction of the to-be-detected substrate (namely, the Y direction) can be obtained. Through an analysis module, the two-dimensional morphology of the wafer substrate can be obtained based on the calculation result of CX and CY. Thus, detection of the two-dimensional morphology of the wafer substrate is completed automatically. Moreover, N first beam splitters in one-to-one correspondence with N laser beams and N second beam splitters in one-to-one correspondence with N laser beams are provided with coating areas, and the reflectance and transmittance properties of each coating area are determined by the propagation direction of corresponding first-type reflected light beams. As the N first beam splitters and the N second beam splitters are of a simple structure and very high coating precision, the consistency of light received by PSDs in different propagation directions is ensured.

Description

technical field [0001] The invention relates to the technical field of non-destructive testing of semiconductor materials, in particular to a device for automatically detecting the two-dimensional shape of a wafer base. Background technique [0002] The invention patent application with the application number 201410188236.2 relates to a device for automatic real-time and rapid detection of the two-dimensional shape of the wafer substrate, including the first calculation module, the second calculation module and the analysis module. The first calculation module is based on the position signals of N spots, Calculate the curvature C of the substrate to be measured along the X direction between any two incident points on the wafer substrate X , the second calculation module calculates the curvature C of any incident point on the wafer substrate in the moving direction of the substrate to be measured, that is, the Y direction, according to the position signals of N light spots Y...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/245
Inventor 刘健鹏
Owner 北京艾瑞豪泰信息技术有限公司
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