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Electroplating quality detection module, printed circuit board motherboard and electroplating quality detection method

A printed circuit and detection module technology, applied in printed circuit components, optical testing flaws/defects, etc., can solve the problems of inability to quickly confirm the quality of electroplating, affecting the production yield and production efficiency of products, reducing quality risks, The effect of avoiding product scrap and improving efficiency

Active Publication Date: 2016-06-29
NEW FOUNDER HLDG DEV LLC +1
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Problems solved by technology

[0006] However, neither of the above two methods can quickly confirm the quality of electroplating, that is, it is impossible to accurately and quickly judge whether there is no copper in the hole, and it will affect the product yield and production efficiency

Method used

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  • Electroplating quality detection module, printed circuit board motherboard and electroplating quality detection method
  • Electroplating quality detection module, printed circuit board motherboard and electroplating quality detection method
  • Electroplating quality detection module, printed circuit board motherboard and electroplating quality detection method

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Embodiment Construction

[0035]In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0036] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0037] figure 2 A block diagram of an electroplating quality detection module according to an embodiment of the present invention is shown.

[0038] Such as figure 2 As shown, the electroplating ...

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Abstract

The invention provides an electroplating quality detection module, a printed circuit board motherboard and an electroplating quality detection method, wherein the electroplating quality detection module is located on the edge of the printed circuit board motherboard, including : detection hole, metal plating is attached on the hole wall of the detection hole, and the aperture of the detection hole gradually decreases from top to bottom, so that the detection hole is in the shape of a circular platform with a large top and a small bottom, so that the detection hole can pass through the The metal coating on the hole wall is inspected for electroplating quality. Through this technical solution, the electroplating quality of the printed circuit board can be directly judged by detecting the detection hole, and whether there is no copper in the hole can be quickly and accurately judged, which reduces the quality risk of the product and improves the efficiency of electroplating quality inspection , to avoid product scrapping caused by destructive slice sampling, and to reduce production costs.

Description

technical field [0001] The invention relates to the technical field of hardware detection, in particular to an electroplating quality detection module, a printed circuit board motherboard and an electroplating quality detection method. Background technique [0002] At present, the demand for high-frequency material products in the society is increasing. Among them, the high-frequency material commonly used in the PCB (Printed Circuit Board, printed circuit board) manufacturing industry is PTFE (Polytetrafluoroethylene, polytetrafluoroethylene). For PTFE high-frequency The general design of materials is the same as that of ordinary PCB products. Such as figure 1 As shown, the printed circuit board motherboard mainly includes two parts: the product graphic design part, where A is the circuit design, B is the BGA (BallGridArray, PCB with ball grid array structure) pad design, C is the hole design, and D is the IC (Integrated Circuit, integrated circuit) pad design; the edge d...

Claims

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Application Information

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IPC IPC(8): H05K1/02G01N21/88
Inventor 陈显任陈继权
Owner NEW FOUNDER HLDG DEV LLC
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