Flexible printed circuit board and method for manufacturing same

Abstract

The present invention relates to a flexible printed circuit board and a method for manufacturing the same, which can implement low resistance characteristics and can simply and easily perform processes, thereby reducing manufacturing costs and enhancing productivity. The method comprises: forming a deposition seed layer on a prepared substrate; forming, on the deposition seed layer, a circuit cover layer having a circuit pattern groove in a shape of a circuit pattern; forming a circuit plating layer in the circuit pattern groove by plating the circuit cover layer; and forming the circuit pattern by etching the circuit plating layer.

Description

technical field [0001] The present invention relates to a flexible printed circuit substrate and a manufacturing method thereof, more specifically, to a flexible printed circuit that uses deposition to form a circuit pattern that can strengthen the adhesion force with a substrate, thereby reducing manufacturing costs and simplifying the manufacturing process Substrate and manufacturing method thereof. [0002] The present invention claims the priority of Korean Patent Application No. 10-2013-0138595 filed on November 14, 2013, the entire content of which belongs to the present invention. Background technique [0003] In general, a flexible printed circuit board is a flexible and bendable substrate in which a circuit pattern is formed on a thin insulating film, and is widely used in portable electronic devices, automation devices that require bending and flexibility for installation, and display products. [0004] In particular, the flexible printed circuit substrate is wide...

AI Technical Summary

Problems solved by technology

[0017] In order to electrically connect the circuit patterns of each layer, the flexible printed circuit board of the multi-layer structure needs to form via holes, but because the manufacturing process is complicated and the insulating films of each layer are bonded and integrated by bonding boards, there are a lot of problems. manufacturing cost issue

[0018] Moreover, the flexible printed circuit board of the multi-layer structure cannot effectively maintain the reliability of work when the adhesive force of the bonding board becomes weak, and due to the limitation of the compressed thickness, the thickness of the product to which the circuit board is applied is increased.

Images