Ball grid array (BGA) ball mounting device based on surface mount technology (SMT) chip mounter
A placement machine and clamping device technology, which is applied to the assembly of printed circuits with electrical components, electrical components, and printed circuit manufacturing. It can solve the problems of inability to restore the height of solder balls, large height gaps, and unusability, and achieve low cost. , high production efficiency, simple and convenient operation
Active Publication Date: 2016-07-06
贵州芯火悦创科技有限公司
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Problems solved by technology
The production speed of this invention is relatively fast and the cost is relatively low. However, due to the use of solder paste for ball planting, the thickness of the stencil and the diameter of the pad opening limit the amount of solder paste, which will lead to a height difference between the reworked BGA and the original package. The gap is large, and the height of the solder balls cannot be restored. It cannot be used for processes that require a high degree of device coordination.
Method used
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[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific preferred embodiments.
[0028] Such as Figure 1 to Figure 6 As shown, a BGA ball planting device based on an SMT placement machine includes an SMT placement machine 1, a placement machine suction nozzle 11, a placement machine track 12, a clamping device 13, an infrared sensor 14, and a solder ball supply device 2 , vibrating material barrel 21, inclined transmission track 22, transparent cover 221, feeding level 222, telescopic baffle 23, heating dehumidifier 24, photoelectric sensor 25, BGA carrier board 3, surrounding frame 31, clamping part 32, bottom plate 33 , counter force pressure plate 34, pressurized air bag 35, pressure sensor 351, height sensor 36, lateral limit slider 37, vertical limit slider 38, backing plate 39, limit post 40, first motor 401, Main technical features such as first displacement sensor 402, L-shaped limit baffle 41,...
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The invention discloses a ball grid array (BGA) ball mounting device based on a surface mount technology (SMT) chip mounter. The BGA ball mounting device comprises the SMT chip mounter, a solder ball supply device and a plurality of BGA support plates, wherein each BGA support plate is fixed on a chip mounter rail by a clamping device and comprises a BGA placing groove and a clamping part, the groove depth and the length size of each BGA placing groove can be adjusted, the solder ball supply device comprises a shaking barrel and an inclined transmission rail, a telescopic baffle plate is arranged on the inclined transmission rail, an arc groove is formed in the inclined transmission rail and is used for placing a solder ball, a transparent cover is arranged above the inclined transmission rail, the depth of the arc groove is not smaller than one second of the diameter of the solder ball, the maximum distance between the transparent cover and the arc groove is smaller than the two times of the diameter of the solder ball, and an included angle between the inclined transmission rail and a horizontal direction is smaller than 30 degrees. After the adoption of the above structure, the BGA ball mounting device is simple and convenient to operate, can be suitable for mass production, and is high in production efficiency, low in cost and high in reducibility.
Description
technical field [0001] The invention relates to the field of BGA processing, in particular to a BGA ball planting device based on an SMT placement machine. Background technique [0002] In the SMT assembly technology, the ball grid array package (BGA) has the characteristics of a large number of solder joints and is hidden under the package, which makes it difficult to control the mounting quality, thus making it difficult to achieve good soldering of the BGA. When repairing a poorly mounted BGA, it needs to be disassembled, which will inevitably cause damage to the solder balls at the bottom of the BGA. To reinstall the BGA, it is necessary to restore the integrity of the solder balls, and the method is to replant the balls. The first step of any ball planting method needs to clean the bottom of the BGA pad, but there are big differences in how to plant balls. [0003] At present, there are two main ball planting methods adopted by various SMT production lines at home and...
Claims
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Login to View More IPC IPC(8): H05K3/34
CPCH05K3/3457H05K2203/041
Inventor 马峻孙建明
Owner 贵州芯火悦创科技有限公司