Manufacturing process for memory bank module circuit board

Abstract

The invention provides a manufacturing process for a memory bank module circuit board. The process comprises: (1), substrate stacking design is carried out by using a board thickness value of a golden finger as a reference; (2), material issuing / cutting are carried out; (3), an internal layer line is manufactured on the substrate and checking is carried out; (4), stitching is carried out; (5), drilling is carried out; (6), total plate electroplating is carried out; (7), an external layer line is manufactured; (8), external layer line graph detection is carried out; (9), sold mask processing; (10), hold melting is carried out; (11) moulding is carried out; (12) testing is carried out; and (13), visual inspection is carried out. According to the manufacturing process, problems that the production benefits are low and the production cost is low because the production flow is long and the plated gold thickness is required to be over 30 microns can be solved. And adverse phenomena of recessing and scratching of a golden finger can be avoided.

Description

technical field [0001] The invention relates in particular to a manufacturing process of a memory module circuit board. Background technique [0002] Traditional printed circuit boards are produced by plated fingers. This method not only has a long production process and requires the thickness of gold-plated gold to be more than 30um, resulting in low production efficiency and high production costs, but also thin gold has strict requirements on the appearance of gold fingers, which needs to be overcome. Problems such as dents and scratches on the gold finger. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a memory module circuit board manufacturing process to overcome the above problems. [0004] In order to solve the above-mentioned technical problems, the present invention provides a memory module circuit board manufacturing process, including the steps: (1) performing substrate stacking design based on the b...

AI Technical Summary

Problems solved by technology

[0002] Traditional printed circuit boards are produced by plated fingers. This method not only has a long production process and requires the thickness of gold-plated gold to be more than 30um, resulting in low production efficiency and high production costs, but also thin gold has strict requirements on the appearance of gold fingers, which needs to be overcome. Problems such as dents and scratches on the gold finger