Micro-assembling miniaturized three-dimensional microwave circuit structure

Abstract

The invention discloses a micro-assembling miniaturized three-dimensional microwave circuit structure comprising an LTCC substrate, a kovar metal support plate, an organic substrate, an aluminum cavity with a separating wall, a plugging member, power supply and microwave insulators and cavity upper and lower cover plates. The kovar metal support plate and the LTCC substrate are upwardly installed on the separating wall in turn. The organic substrate is installed below the separating wall. The plugging member is welded on the organic substrate. Multiple power supply insulators and microwave insulators are welded and fixed on the separating wall. One end of each insulator pin is welded on the corresponding position of the back substrate welding disc, and the other end of each insulator pin is connected on the front LTCC substrate welding disc through gold wire bonding. The cavity upper cover plate is welded on the cavity through laser sealing welding so that the internal part of the upper cavity is enabled to be sealed. The micro-assembling miniaturized three-dimensional microwave circuit structure is simple in assembling technology, high in mechanical intensity and small in packaging size.

Description

technical field [0001] The invention belongs to the technical field of miniaturized packaging of microwave or millimeter wave circuits and systems, and in particular relates to a micro-assembled and miniaturized three-dimensional microwave circuit structure. Background technique [0002] Microwave microassembly technology (MMCM) is the key technology to realize the miniaturization, light weight, high performance and high reliability of the electronic machine. The LTCC (low temperature co-fired ceramic) substrate can realize the embedding of passive devices due to its good microwave signal transmission performance. Therefore, the technology based on LTCC substrate and micro-assembly is an important way to realize the miniaturization of microwave modules and systems. However, the ceramic substrate has disadvantages such as high price, brittleness, and weak adhesion of soldered devices on the ceramic substrate. Although organic substrates are cheap, have high mechanical streng...

AI Technical Summary

Problems solved by technology

However, ceramic substrates have disadvantages such as high price, brittleness, and weak adhesion of soldered devices on ceramic substrates.

Although organic substrates are cheap, have high mechanical strength, and stable and reliable welding, ordinary organic substrates cannot be used for micro-assembly of bare chips, which makes it difficult to reduce volume and improve integration by using organic substrates.

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