Silicon rod combined machining machine

Abstract

The invention provides a silicon rod combined machining machine which comprises a machine base, a silicon rod squaring device, a silicon rod conveying device, a face grinding device, a rolling and polishing device and a silicon rod transferring device. The face grinding device is used for conducting the face grinding operation on a silicon rod. The rolling and polishing device is used for conducting the rolling and polishing operation on the silicon rod obtained after the face grinding is conducted on the silicon rod through the face grinding device. The silicon rod transferring device is used for transferring the silicon rod squared by the silicon rod squaring device to the silicon rod conveying device from the silicon rod squaring device and transferring the silicon rod machined by the face grinding device and the rolling and polishing device out of the silicon rod conveying device. By means of the silicon rod combined machining machine, the multiple operation devices are integrated and include the silicon rod squaring device, the face grinding device and the rolling and polishing device, all of which are adjacent, the silicon rod transferring device can be used for transferring the silicon rod to be machined among all the operation devices, operation in the multiple processes for silicon rod machining can be achieved automatically, the labor cost is saved, and in addition, the production efficiency is improved.

Description

Technical field [0001] The invention relates to the technical field of workpiece processing, in particular to a silicon rod assembly processing machine applied to silicon rods. Background technique [0002] At present, with the society's attention and openness to the use of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut by a multi-wire saw after pulling or casting a silicon ingot. [0003] The current production process of silicon wafers is generally to first pull the polycrystalline silicon brittle material into a single crystal silicon rod, and then use a square rooting machine to square the square; at this time, the cutting mechanism feeds along the length of the silicon rod and runs around the silicon rod. Cut four parallel planes up by two to make the ...

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a combined processing machine for silicon r

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