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Light emitting assembly

A technology of optical emission components and components, which is applied in the field of optical communication, can solve problems such as easy distortion, and achieve the effect of ensuring integrity and high quality

Active Publication Date: 2016-09-21
湖北瑞创信达光电有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Distortion is prone to occur due to multiple signal conversions in the middle of the signal, especially on 25G high-speed optoelectronic devices

Method used

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Embodiment Construction

[0025] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0026] Such as figure 1 As shown, it is a schematic structural diagram of the light emitting component provided by the embodiment of the present invention. The embodiment of the present invention aims at the problems in the prior art that the number of conversion nodes is too large in the signal transmission process of the high-speed 25G optical transmission component, which further affects the integrity and quality of the photoelectric signal transmission, and provides an optical transmission component, including: pins 1. The tube body 2 connected to the pin 1 and the TO assembly 3 connected to the tube body 2; wherein,

[0027] Such as figure 2 , which is a schematic diagram of the internal structure of the TO component of the lig...

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Abstract

The invention provides a light emitting assembly, which comprises a contact pin, a tube body connected with the contact pin, and a TO assembly connected with the tube body, wherein, the TO assembly comprises a driving chip, a flexible circuit, a semiconductor laser chip, a transition block and a TO base; the driving chip is fixed on the base; the flexible circuit is fixed on the base and achieves electrical connection with both sides of the TO base through gold wires, and an electric signal is converted into a light signal and output through the contact pin; the semiconductor laser chip is fixed on the transition block; and the transition block is fixed on the TO base, and achieves electrical connection with the driving chip through gold wires. The light emitting assembly has the advantages of reducing a transition link in the signal transmission process, ensuring integrality and quality of the signal, completing optimal signal injection, playing a key role in optimal signal output, and being conductive to output of high-quality photoelectric signals.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical emitting component. Background technique [0002] With the rapid development of optical communication technology, high-speed and large-capacity optical communication components have become the future development direction. The optical transmitting components and optical receiving components in the entire network are the core components. Among them, the research on 25G optical transmitting components has received more and more attention. The traditional light emitting component is realized by pin, tube body, TO (Transisitor outline, transistor outline) base and soft board, and only the semiconductor transmitter chip inside the TO is electrically connected to the PIN pin through a gold wire, and then through The matching of the flexible board realizes the conversion input of the electrical signal and the output of the optical signal. The whole process inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4281G02B6/4296
Inventor 雷星宇王长虹李恭鹏
Owner 湖北瑞创信达光电有限公司