Punching mould for inner cambered-surface towing hook mounting hole of closed bumper
A bumper and mounting hole technology, which is applied in the field of punching dies for processing the mounting holes of the inner arc surface of the closed bumper, can solve the problems of difficult removal, inner arc surface and side wall folds, high production costs, etc., and achieve improvement The effect of product production efficiency, product quality improvement and production cost saving
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0022] See figure 1 , figure 2 The present invention includes an upper template 11, a lower template 1, a concave mold 15 and a convex mold 18. The upper template is connected to the punch slider 12, and the upper template moves up and down with the movement of the punch slider to complete the punching and scrapping operations. Guide posts 2 are symmetrically arranged on the lower template, and guide sleeves 9 are arranged at positions corresponding to the upper template and each guide post. The guide posts and guide sleeves are in sliding cooperation to guide the up and down movement of the upper template. The convex mold and the concave mold of the mold adopt a flip-chip structure, that is, the concave mold is on the top and the convex mold is on the bottom. The upper template is fixedly connected to the female mold fixing plate 10, and the female mold is fixedly connected to the female mold fixing plate. The lower template 1 is fixedly connected to the convex mold backing ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap