Multilayer composite copper foil forming equipment

Abstract

The invention discloses multilayer composite copper foil forming equipment which is characterized in that a top frame is located over a bottom frame; a first guide rail and a second guide rail are parallelly and oppositely arranged on the top frame and the bottom frame respectively; a first sliding seat and a second sliding seat are driven to slide on the first guide rail and the second guide rail by a first driving device and a second driving device respectively; a first carrier is arranged on the first sliding seat; a second carrier comprises carrier seat and a telescopic set; the lower end of the telescopic set is fixedly connected with the second sliding seat; the upper end of the telescopic set is fixedly connected with the carrier seat; the telescopic set can extend and retract lengthways; the carrier seat can extend to the upper side of the top frame; a clamping device can place a plurality of pieces of copper foil material, of which the positions are set, on the first carrier and the second carrier at one end of an exchange device one by one; and a conveying device can convey multilayer composite copper foil products on the first carrier and the second carrier at one end of the exchange device to specific positions. The multilayer composite copper foil forming equipment is compact in structure, occupies small space, has high production efficiency and is low in manufacturing cost.

Description

technical field [0001] The invention relates to a circuit board manufacturing equipment, in particular to an equipment for forming copper foil and dielectric material cladding in the circuit board manufacturing process. Background technique [0002] A circuit board is a carrier used to carry electronic components and electrically connect each electronic component. [0003] The structure of the circuit board in the prior art, one of which is a multi-layer circuit board with a multi-layer bonding structure, its structure is formed by overlapping and stacking a plurality of dielectric layers and a plurality of conductive layers, and conductive lines are arranged on the conductive layer. Connect the electronic components, and the dielectric layer is used as the insulating base material between the conductive layers, and then the conductive layer and the dielectric layer are combined into a whole through hot pressing; the material of the conductive layer is generally copper foil,...

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Problems solved by technology

[0004] However, in the prior art, the forming process of the copper foil and the dielectric layer of the circuit board is through the cooperation of the conveyor belt and the robot arm. The sequence is moved one by one and placed on the conveyor belt and the conductive layer and the dielectric layer are stacked to complete the structure of the copper foil and the dielectric material cladding. The required space increases, not only can not effectively use the factory space, but also lengthen the time required for the process

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