Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Liquid-packaged high-power three-primary color LED chip array distribution and production

A technology of LED chip and liquid packaging, applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., can solve the problems of poor luminous uniformity, low color rendering index, difficult heat dissipation of high-power LED packaging, etc., to achieve high color rendering index, The connection circuit is simple and the effect of the uniformity of the bukkake is good

Inactive Publication Date: 2016-10-05
彭冬生
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of difficult heat dissipation, poor luminous uniformity, and low color rendering index existing in the existing high-power LED packaging technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid-packaged high-power three-primary color LED chip array distribution and production
  • Liquid-packaged high-power three-primary color LED chip array distribution and production
  • Liquid-packaged high-power three-primary color LED chip array distribution and production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A liquid-encapsulated high-power LED device, the cross-sectional schematic diagram is shown in figure 1 As shown, it includes a transparent baffle 11 , a transparent liquid 12 , a metal shell 13 , a three-color LED chip array 14 , a substrate 15 , and a heat sink 16 . The schematic diagram of the overall device is shown in figure 2 As shown, its appearance can be designed according to requirements, it can be a square column type, or an irregular polyhedron type.

[0025] Tricolor LED chip distribution array such as image 3 As shown in 13, the array of three-primary-color LED chips includes red LED chips 21, green LED chips 22, and blue LED chips 23, and the three-primary-color LED chips are arranged in a manner of maintaining a 1:1:1 overall and partial range. distributed on a ceramic substrate. The odd-numbered rows of three-primary-color LED chips are arranged in the order of "RBG...RBG...", and the even-numbered rows of three-primary-color LED chips are arranged...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses liquid-packaged high-power three-primary-color LED chip array distribution and production. According to the invention, a chip array is arranged on a substrate, odd-numbered lines of three-primary-color LED chips are arranged according to a sequence of RBG, even-numbered lines of three-primary-color LED chip are arranged according to a sequence of BGR, the ratio of numbers of the three types of chips both in an overall scope and a local scope can be kept to be 1:1:1, and the chips of the same color in the three-primary-color LED chip array are connected in series and / or in parallel according to an electrode array mode; and then the substrate is placed in a metal shell, a transparent baffle plate is arranged at an opening of the shell, then the part above the chips is filled with a light transmission insulating liquid, and the light transmission insulating liquid is sealed in a metal cavity through the transparent baffle plate. The transparent liquid takes heat away quickly through convection and transfers the heat to the metal shell, and the heat quickly spreads to the air, so that the heat dissipation efficiency is higher. A white-light LED realized adopting the liquid-packaged high-power three-primary-color LED chip array distribution and production is good in light emitting uniformity and high in display index.

Description

technical field [0001] The invention relates to the field of lighting sources, in particular to a liquid-encapsulated high-power LED device and an array distribution of R, G, and B three-primary color chips. Background technique [0002] Solid-state lighting based on Light Emitting Diode (Light Emitting Diode) is considered to be the light source of the 21st century. Compared with traditional light sources, Light Emitting Diode has the characteristics of high luminous efficiency, long life, small size, and fast response. [0003] In the early application of light-emitting diodes, due to the relatively low power, little heat is generated, and the heat dissipation problem does not need to be considered. With the emergence of high-brightness monochrome and white light-emitting diodes, it has become a trend to apply light-emitting diodes to daily lighting. When using power-type light-emitting diodes for lighting, one of the most important problems that needs to be solved is heat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/64
Inventor 彭冬生曾丹谭聪聪
Owner 彭冬生
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com