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CPU cooling device

A technology of heat dissipation device and heat fin, which is applied to instruments, computing, electrical and digital data processing, etc., can solve problems such as unfavorable arrangement of other components, external environment interference, large space occupation, etc., and achieves small size, easy integration, and reduced interference. Effect

Pending Publication Date: 2016-10-12
GUANGDONG UNIV OF TECH
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] At present, the most commonly used CPU cooling device is generally a liquid circulation cooling device, which mainly integrates the fan on the condensate tank to dissipate heat from the CPU chip through fan cooling. However, due to the large volume of the fan, it takes up a large space, which is not conducive to other The layout of the components in the electronic equipment, and the noise of the fan is relatively loud, which is easy to cause interference to the external environment

Method used

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Embodiment Construction

[0022] The core of the present invention lies in a CPU cooling device, which not only has a small volume, but also facilitates the arrangement of other components in the electronic equipment, and can reduce noise and reduce interference to the external environment.

[0023] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] Such as figure 1 Shown, a kind of CPU cooling device comprises liquid cooling circulation system, is provided with the condensed water tank 5 that releases heat in the liquid cooled circulatory system, is provided with ion wind device 51 on the condensed water tank 5, and is arranged on the condensed water tank 5 in the prior art Compared with the fan, the ion wind device 51 has a small volume and is easy to integrate, so that the overall volume of the CPU coolin...

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Abstract

The invention provides a CPU cooling device. The CPU cooling device comprises a liquid cooling circulating system. The liquid cooling circulating system is internally provided with a condensate water tank for releasing heat, and the condensate water tank is provided with an ionic wind device. Due to the fact that the ionic wind device is small in size and easy to integrate, the overall size of the CPU cooling device is reduced, and distribution of other components in an electronic device is achieved easily; due to the fact that no mechanical motion exists in the cooling process of the ionic wind device, the noise can be effectively lowered, and the interference of the external environment is reduced.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a CPU radiator. Background technique [0002] In today's era, with the development of miniaturization of electronic equipment, the design of CPU chips is becoming more and more compact, and the miniaturization requirements for CPU cooling devices are also becoming more and more obvious. [0003] At present, the most commonly used CPU cooling device is generally a liquid circulation cooling device, which mainly integrates the fan on the condensate tank to dissipate heat from the CPU chip through fan cooling. However, due to the large volume of the fan, it takes up a large space, which is not conducive to other The layout of the components in the electronic equipment, and the noise of the fan is relatively loud, which is likely to cause interference to the external environment. [0004] Therefore, how to design a CPU cooling device that is not only small in size, is conducive to...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 王长宏冯杰谢泽涛
Owner GUANGDONG UNIV OF TECH