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Cu ball, cu core ball, solder joint, solder paste, and solder foam

一种芯球、球形度的技术，应用在焊膏和成形焊料,钎焊接头,Cu球,Cu芯球领域，能够解决无法保持基板适当空间、焊料球压碎等问题，达到抑制高度的不均匀、提高耐落下冲击性、确保自动对位性的效果

Active Publication Date: 2016-10-12
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when BGA is applied to a semiconductor package mounted in three-dimensional high density, solder balls may be crushed due to the weight of the semiconductor package
If this happens, it becomes impossible to maintain proper space between the substrates

Method used

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  • Cu ball, cu core ball, solder joint, solder paste, and solder foam
  • Cu ball, cu core ball, solder joint, solder paste, and solder foam
  • Cu ball, cu core ball, solder joint, solder paste, and solder foam

Examples

Experimental program
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Effect test

Embodiment 1

[0099] Next, after placing Cu balls made of Cu pellets with a purity of 99.9% into a carbon disk, the disk was carried into a continuous conveyor type resistance heating furnace to perform annealing treatment. The annealing conditions at this time are shown in figure 2. In addition, in order to prevent oxidation of Cu balls, the inside of a furnace was made into nitrogen gas atmosphere. The room temperature is 25°C.

[0100] As an annealing condition, such as figure 2 As shown, the heating time from room temperature to 700°C was 60 minutes, the holding time at 700°C was 60 minutes, and the cooling time from 700°C to room temperature was 120 minutes. Cooling in the furnace was performed using a cooling fan installed in the furnace. Next, an acid treatment was performed by immersing the annealed Cu balls in dilute sulfuric acid. This is to remove the oxide film formed on the surface of the Cu ball by the annealing treatment.

[0101] The Vickers hardnesses of the Cu ball...

Embodiment 2

[0103] In Example 2, the annealing treatment and the oxide film removal treatment were performed in the same manner as in Example 1 for Cu balls produced from Cu wires having a purity of 99.995% or less shown in Table 1. Then, the Vickers hardness of the obtained Cu balls was measured. In addition, the sphericity and α-ray dose of the Cu balls after the annealing treatment were measured by the above-mentioned methods, respectively. These measurement results are shown in Table 2 below.

Embodiment 3

[0116] Next, the sphericity and α-ray dose of the Cu core balls obtained using the above-mentioned Cu balls before and after the annealing treatment will be described. In Example 3, the sphericity and α-ray dose of the Cu core ball produced by coating the surface of the annealed Cu ball in Example 1 with a Ni plating layer of 2 μm on one side were measured by the method described above. These measurement results are shown in Table 3 below.

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Abstract

Provided are: a Cu ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; a Cu core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60) is configured in a manner such that a solder bump (30) of a semiconductor chip (10) and an electrode (41) of a printed circuit board (40) are joined by a solder paste (12, 42). The solder bump (30) is formed by joining a Cu ball (20) to an electrode (11) of the semiconductor chip (10). This Cu ball (20) exhibits a purity of 99.9-99.995%, inclusive, a sphericity of 0.95 or higher, and a Vickers hardness of 20-60HV, inclusive.

Description

technical field [0001] The present invention relates to Cu balls, Cu core balls, brazing joints, solder paste and shaped solder. Background technique [0002] In recent years, due to the development of small information equipment, the electronic components mounted therein are rapidly miniaturized. In response to the demand for miniaturization of electronic components, a ball grid array package (hereinafter referred to as "BGA") with electrodes provided on the rear surface is being used in order to cope with the reduction in the size of connection terminals and the reduction in mounting area. [0003] Among the electronic components using BGA, there is, for example, a semiconductor package. In the semiconductor package, a semiconductor chip having electrodes is sealed with resin. Solder bumps are formed on electrodes of the semiconductor chip. The solder bumps are formed by bonding solder balls to electrodes of the semiconductor chip. A semiconductor package using a BGA i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02B23K35/14B23K35/22B23K35/30C22B15/14C22C9/00C22F1/00C22F1/08C25D7/00B22F1/065B22F1/17
CPCB23K35/22C22C9/00C22F1/00C22F1/08B23K35/302B23K35/025C22C1/0425B23K35/0244C22C9/02B22F1/065B22F1/17
Inventor 川崎浩由六本木贵弘相马大辅佐藤勇
Owner SENJU METAL IND CO LTD