Laser processing method and equipment for removing film or coating
A laser processing method and laser processing technology, which are applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of difficult and accurate removal of product surface coating or film
Active Publication Date: 2018-02-23
INNO LASER TECH CORP LTD
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Problems solved by technology
[0003] The purpose of the present invention is to provide a laser processing method and equipment for removing film or coating, which solves the current technical problem that it is difficult to efficiently and accurately remove coating or film on the surface of products
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Embodiment Construction
[0026] The present invention will be further elaborated below with reference to the accompanying drawings.
[0027] Please refer to the attached figure 2 , in this embodiment, the laser processing method for removing a thin film or a coating comprises the following steps:
[0028] The first step S1 is to measure and obtain the thickness value of the film or coating; that is, to obtain the thickness of the film or coating at different positions in real time by means of measurement;
[0029] In the second step S2, the parameters of the laser are adjusted according to the thickness obtained in the first step; the parameters of the laser adjustment in this step include laser output laser power, laser frequency, galvanometer scanning speed, platform moving speed, processing times, etc., according to thickness carried out;
[0030] The third step S3 is to turn on the laser, repeat the first step S1 and the second step S2, and scan the laser on the surface of the film or coating u...
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A laser processing method for removing a thin film or a coating, comprising the following steps: first step, acquiring a thickness value of a thin film or a coating by means of measurement; second step, according to the thickness value acquired in the first step, adjusting a parameter of a laser; and third step, starting a laser device, and repeatedly performing the first step and the second step, so that the laser scans the surface of the thin film or the coating, until the thin film or the coating is removed. A certain thickness value or a related physical quantity value is pre-set as a reference, and preliminary processing is performed; and when the measured thickness of a thin film or a coating or the related physical quantity is consistent with a pre-set value, adjusting a processing parameter to perform fine processing, until the thin film or the coating is removed. Compared with the prior art, in the laser processing method and device for removing a thin film or a coating, the thickness of a thin film or a coating is measured in real time, and accordingly, a laser parameter is adjusted, so the present invention achieves the optimal removal effect, and is fast and accurate.
Description
technical field [0001] The invention relates to the technical field of thin film removal, in particular to a laser processing method and equipment for removing thin film or coating by laser. Background technique [0002] In the process of processing, we often encounter the technological requirements of film or coating removal, such as producing marks by removing part of the film or coating; by removing part of the film or coating to achieve certain properties of the workpiece (such as electrical conductivity, Insulation, light transmission, etc.); or coating film or coating for protection and other functions during processing, and the film layer or coating needs to be removed after certain processes are completed. Since the film or coating is generally thin and has strong adhesion, it is difficult to achieve efficient and accurate removal by traditional mechanical means. The emergence of laser processing technology has solved this problem to a certain extent, but because th...
Claims
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IPC IPC(8): G01B11/06G01B21/08B23K26/36B23K26/06B23K26/57
CPCB23K26/0626B23K26/36B23K26/57
Inventor 陶沙赵晓杰秦国双
Owner INNO LASER TECH CORP LTD