Thermal grain-sized dicing technology for phenolic moulding plastic

A technology of phenolic molding compound and hot-cut granulation, which is applied in the field of thermosetting molding compound. It can solve the problems that the thermal pulverizer cannot meet the production requirements of phenolic molding compound, affect normal production operations, and the screening powder removal rate is not high, so as to improve quality stability. And qualified rate, high production efficiency, and stable product quality

Inactive Publication Date: 2016-11-09
YUZHOU YUANDA PLASTIC ELECTRICAL APPLIANCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the production of phenolic molding compounds at home and abroad is produced by double-roll mills or screw machines, pressed into tablets, conveyed by conveyor belts or belts, and then pulverized by a pulverizer. During the pulverization process, the dust is very large, and the powder removal rate of screening Not high, and the thermal pulverizer cannot meet the production requirements of phenolic molding com

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A phenolic molding compound hot pelletizing process, the process steps are as follows:

[0020] Step 1): raw material pretreatment: crush the raw material to a particle size of less than 1mm to remove impurities;

[0021] Step 2): Use a ball mill, add ceramic balls into the ball mill, put the pretreated phenolic resin, catalyst and mold release agent into the ball mill and mill for 10-24 hours;

[0022] Step 3): Ingredients mixing: Put the raw materials into the mixer and mix for 20-40 minutes;

[0023] Step 4): Extrusion: Add the mixed raw materials into the extruder, and set the temperature of the extrusion port between 120-130 degrees Celsius;

[0024] Step 5): Rolling: Use a rolling machine with a diameter of 0.8-1.5m to press the material extruded by the extruder into a sheet with a thickness of 1-20mm. The inside of the roller is water-cooled and air-cooled. Cooling method to ensure that the temperature of the roller surface is below 40°C;

[0025] Step 6): Con...

Embodiment 2

[0029] A phenolic molding compound hot pelletizing process, the process steps are as follows:

[0030] Step 1): raw material pretreatment: crush the raw material to a particle size of less than 1mm to remove impurities;

[0031] Step 2): Use a ball mill, add ceramic balls into the ball mill, put the pretreated phenolic resin, catalyst and mold release agent into the ball mill and mill for 10-24 hours;

[0032] Step 3): Ingredients mixing: Put the raw materials into the mixer and mix for 20-40 minutes;

[0033] Step 4): Extrusion: Add the mixed raw materials into the extruder, and set the temperature of the extrusion port between 120-130 degrees Celsius;

[0034] Step 5): Rolling: Use a rolling machine with a diameter of 0.8-1.5m to press the material extruded by the extruder into a sheet with a thickness of 1-20mm. The inside of the roller is water-cooled and air-cooled. Cooling method to ensure that the temperature of the roller surface is below 40°C;

[0035] Step 6): Con...

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PUM

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Abstract

The invention relates to a thermal grain-sized dicing technology for phenolic moulding plastic. The technology includes the following steps that firstly, a raw material is pretreated; secondly, a ball grinding mill is used, ceramic balls are added into the ball grinding mill, and pretreated phenolic resin, a catalyst and a release agent are put into the ball grinding mill to be subjected to ball grinding for 10 h to 24 h; thirdly, burdening and mixing are conducted; fourthly, extruding is conducted; fifthly, rolling is conducted; sixthly, conveying and slitting are conducted; and seventhly, screening and packaging are conducted. The technology has the beneficial effects of being reasonable, high in production efficiency and stable in product quality.

Description

technical field [0001] The invention belongs to the technical field of thermosetting molding compounds, in particular relates to a phenolic molding compound, in particular to a thermal pelletizing process of the phenolic molding compound. Background technique [0002] At present, the production of phenolic molding compounds at home and abroad is produced by double-roll mills or screw machines, pressed into tablets, conveyed by conveyor belts or belts, and then pulverized by a pulverizer. During the pulverization process, the dust is very large, and the powder removal rate of screening Not high, and the thermal pulverizer cannot meet the production requirements of phenolic molding compound due to the hysteresis of heating. The heat generated during the pulverization process is large, which makes the phenolic molding compound soften in the pulverizer, clogging the pulverizer and the screen, and affecting normal production. Therefore, it is very necessary to provide a thermal p...

Claims

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Application Information

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IPC IPC(8): B29B9/02B29C35/04
CPCB29B9/02B29C35/045
Inventor 朱冠军
Owner YUZHOU YUANDA PLASTIC ELECTRICAL APPLIANCE
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