A Surface Mounting Method for Deep Cavity Microwave Components
A technology of microwave components and assembly methods, applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuit manufacturing, etc., can solve the problems of wasting time, large design limitations, long solder assembly time, etc. demand, increase design diversity, and reduce the effect of process difficulty
Active Publication Date: 2018-07-13
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
View PDF10 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] The existing assembly of microwave components with deep cavity structures has the following problems: 1) The selection of solder is limited and the assembly time is long, especially for structures with many welding requirements. On the one hand, the type of solder often cannot meet the design requirements; a lot of time
2) Manual soldering of components cannot guarantee the consistency of the process, and for components with pads at the bottom of the device such as QFN, BGA, etc., manual soldering cannot be performed, and the design limitations are large
If the existing SMT equipment is used, it is impossible to complete the automatic printing of solder paste and patch in the deep cavity structure
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0070] see figure 2 , 3 and 4, for deep-cavity microwave component double-sided assembly method, including the following steps ( figure 1 shown):
[0071] a) Cut the Sn63Pb37 solder sheet with a thickness of 0.1mm by hand. The size of the solder sheet is the same as that of the microstrip board. After cutting, use a surgical blade to clean the oxide layer on both sides of the solder sheet, and clean it with alcohol cotton balls , Generally, it needs to be scrubbed more than 3 times until the color does not change.
[0072] b) Install the solder tab and microstrip board in the box, apply a small amount of flux on the soldering surface, and use positioning pins for positioning.
[0073] c) Use a solder paste jet printer to print solder paste on the position of the soldered components on the microstrip board. The composition of the solder paste is also Sn63Pb37, and the thickness of the solder paste is controlled at 0.12mm.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a surface assembly method for a deep-cavity microwave component. The surface assembly method comprises the steps of obtaining a first soldering lug from which an oxide layer is removed; obtaining a box body which is located for the first time; obtaining a first micro-strip board printed with soldering paste and finishing the box body printed by the soldering paste for the first time; obtaining a first micro-strip board pasted with a component and finishing the box body pasted with the component for the first time; obtaining the box body provided with a first pressure distributing tooling; obtaining the box body which is welded for the first time; obtaining the box body which is welded for the second time; and taking out and cleaning the box body which is welded for the second time to obtain a finished product. The surface assembly method for the deep-cavity microwave component has the beneficial technical effects that multiple welding of double sides of the microwave component can be finished through only one soldering flux; the dependence on temperature gradients of different soldering fluxes is reduced; automatic assembly of a surface mounting component is also achieved; large-area grounding welding of the micro-strip board and component welding are simultaneously carried out; the production efficiency is improved; and the assembly error and the process difficulty are reduced.
Description
technical field [0001] The invention relates to the technical field of electrical interconnection, in particular to a surface assembly method of a deep-cavity microwave component. Background technique [0002] In recent years, with the development of electronic equipment in the direction of miniaturization, light weight, and high reliability, corresponding requirements have been put forward for the design of unit structures such as modules and the corresponding manufacturing processes. For microwave components, the structure, manufacturing and assembly technology of different components directly affect the electrical performance and become the key to determine the success of the device. [0003] Microwave components, especially deep-cavity double-sided structure components, are usually composed of housings, microstrip boards, and components. How to effectively and reasonably interconnect the three has become an urgent problem for process designers to solve. [0004] Traditi...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/32H05K3/34
CPCH05K3/32H05K3/328H05K3/34H05K3/341
Inventor 孙晓伟邱颖霞程明生陈该青蒋健乾
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST