Monocrystalline silicon wafer texture surface making additive and application

Abstract

The invention provides a monocrystalline silicon wafer texture surface making additive. The monocrystalline silicon wafer texture surface making additive comprises the following components in percentages by mass: 0.1%-3% of a component A, 0.01%-10% of a component B and the balance of water. The component A is selected from one or more of crown ether, crown ether derivatives and alkali metal complex of the crown ether; and the component B is alcohol ether. The invention further provides texture surface making liquid for monocrystalline silicon wafer texture surface making. The texture surface making liquid contains an alkali solution and the monocrystalline silicon wafer texture surface making additive. The invention further provides a monocrystalline silicon wafer texture surface making method. Texture surface making on a monocrystalline silicon wafer is carried out by the texture surface making liquid. The additive is added in the monocrystalline silicon wafer texture surface making liquid, so that texture surface making reaction becomes fast, quick texture surface making on the monocrystalline silicon wafer cut by a diamond wire can be carried out, the capacity is improved, uniform and compact texture surface pyramids can be obtained, the reflectivity is reduced, and the efficiency of a battery is improved.

Description

technical field [0001] The invention relates to a monocrystalline silicon wafer texturing additive and its application. Background technique [0002] At present, the conventional texturing process of monocrystalline silicon wafers generally uses sodium hydroxide or potassium hydroxide, and appropriately adds non-alcoholic texturing additives for texturing. This texturing process is more suitable for mortar sheets, but with the popularity of diamond wire cut silicon wafers, the above texturing process can no longer meet the needs of production lines. [0003] Compared with traditional mortar sheets, silicon wafers cut by diamond wire have heavy traces, small damage layer, and slow reaction speed. If conventional texturing additives are still used, the texturing time will be too long, the production capacity will be reduced, and the uniformity of the texturing pyramid will be uneven. Well, not conducive to further improving battery efficiency. Contents of the invention [...

AI Technical Summary

Problems solved by technology

This texturing process is more suitable for mortar sheets, but with the popularity of diamond wire cut silicon wafers, the above texturing process can no longer meet the needs of production lines

[0003] Compared with traditional mortar sheets, silicon wafers cut by diamond wire have heavy traces, small damage layer, and slow reaction speed. If conventional texturing additives are still used, the texturing time will be too long, the production capacity will be reduced, and the uniformity of the texturing pyramid will be uneven. Well, not conducive to further improving battery efficiency

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