Method for preparing micro coaxial metal structure on metal substrate

Abstract

The invention discloses a method for preparing a micro coaxial metal structure on a copper substrate. The method comprises the following steps: firstly coating negative photoresist on the copper substrate, exposing and developing the negative photoresist layer via ultraviolet light under a mask to obtain a coating structure of a metal substrate layer, and carrying out micro electroforming to obtain the metal substrate layer; coating photoresist on the metal substrate layer, photoetching and developing the same to obtain a support body, coating the negative photoresist on the support body, and carrying out photoetching, developing and copper micro electroforming to obtain a metal inner shaft; stripping off all negative photoresist on the metal substrate to obtain a three-layer micro structure, coating the negative photoresist thereon, carrying out photoetching and developing to obtain the coating structure of an inverted U-shaped metal shell, electroforming metal copper on the coating structure, and stripping off the negative photoresist to obtain a micro coaxial structure. According to the method disclosed by the invention, a one-time micro electroforming molding method is adopted on the outer wall of the micro coaxial metal to solve the problems of the existing multilayer continuous processing craft that the centers are difficult to align, the roughness of the outer wall of the metal is large and that the verticality is low, the process steps are not only simplified, the processing period can be shortened, the processing difficulty can be reduced, and the processing cost is lowered.

Description

technical field [0001] The invention relates to the technical field of metal microstructure manufacture, in particular to a method for preparing a micro-coaxial metal structure on a metal substrate. Background technique [0002] In the microstructure, the microstructure obtained by very thin microprocessing on the base material is usually called a two-dimensional microstructure. For those microstructures that are simple in structure and do not contain curved surfaces or slopes, they are called quasi-three-dimensional microstructures, such as deep grooves and steps whose sidewalls are perpendicular to the surface. Only microstructures containing curved surfaces or arbitrary complex shapes are called three-dimensional microstructures. In MEMS (micro-electromechanical systems), in order to meet the requirements of function and assembly, many components need to have three-dimensional microstructures such as inclined surfaces and free-form surfaces, especially micro-coaxial stru...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for preparing a micro-coaxial metal structure on a metal substrate. The technical means adopted are UV-LIGA, micro-electroforming and micro-electroforming post-processing technology, and the metal shell is formed by one-time micro-electroforming. It can solve the problems of difficult center alignment, large metal outer wall roughness and low verticality existing in the current multi-layer continuous processing technology

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