Chip and manufacturing method thereof
A manufacturing method and chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems that limit the popularization and application of 3D chips, and avoid granular defects and chip yield reduction and stability Improved effect
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[0033] It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other if there is no conflict. Hereinafter, the present invention will be described in detail with reference to the drawings and in conjunction with the embodiments.
[0034] It can be known from the background technology that there is a problem that the edge washing process will cause the stability of the chip to decrease in the manufacturing process of the existing chip. The inventor of the present application has conducted a large number of experimental studies to solve the above problems. By chance, the inventor found that after the edge washing process removes the conductive layer in the through silicon via, the inner wall of the through silicon via is directly exposed. At this time, the barrier layer on the inner wall of the through silicon via at the edge is also directly exposed. The exposed barrier layer is easily damaged, cracked or even peele...
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