Solar chip module manufacturing process

Abstract

The invention provides a solar chip module manufacturing process, which comprises the steps of firstly separating a plurality of chips from a wafer, dispensing solar paste on a first electrode of one chip, then superimposing a second electrode of another chip on the solar paste, carrying out non-contact welding, enabling the plurality of chips to be welded into a series welding structure, welding external electrodes on the chips at both ends of the series welding structure respectively, and carrying out a step of substrate combining and packaging. In the series welding structure, the chips are combined by the solder paste, and the chips are mutually superimposed, so that problems of poor series welding efficiency, easy chip breaking in the series welding process and the like caused by serially connecting the chip by a welding strip in the existing manufacturing process can be solved. The solar chip module manufacturing process provided by the invention can improve the welding speed and is capable of effectively preventing generation of broken chips.

Description

technical field [0001] The invention relates to a photovoltaic module or a single photovoltaic battery array, in particular to a solar chip module manufacturing process capable of improving the efficiency and quality of string welding. Background technique [0002] A solar chip module refers to a photoelectric element used to absorb the energy of sunlight and separate the electrons and protons of the semiconductor material in the chip to generate current; the solar chip module is formed by connecting a plurality of chips in series to form a series welding structure. Then several series welding structures are electrically connected and packaged. An existing series welding structure, such as Figure 7 As shown, it includes a plurality of chips 70, a plurality of welding strips 80 and a plurality of external electrodes 90. This series welding structure is to connect the chips 70 in series with the welding strips 80, so as to increase the voltage of the solar chip module. The ch...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of poor soldering efficiency and easy chip damage caused by the existing solar chip module manufacturing process using solder tape to connect the chips in series, the present invention proposes a solar chip module manufacturing process, which is combined with solder paste. The chips in the string-welding structure are superimposed on each other, which can avoid the procedure of flipping the chips during string-soldering, avoid the generation of fragments when flipping the chips, and improve the production efficiency and yield of solar chip modules.

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