led chip and its manufacturing method

Abstract

The present invention provides a LED chip and a manufacturing method thereof. The manufacturing method comprises: providing a substrate, an N-type semiconductor layer, an active layer and a P-type semiconductor layer; forming first and second transparent conductive layers; forming metal reflective layers including sliver having a work function larger than the transparent conductive layers, wherein the metal reflective layer located on the first transparent conductive layer is a P electrode, and the metal reflective layer located on the second transparent conductive layer is an N electrode; the LED chip includes the substrate, the N-type semiconductor layer, the active layer, the P-type semiconductor layer and first and second transparent conductive layers; and the metal reflective layer located on the first transparent conductive layer is the P electrode, and the metal reflective layer located on the second transparent conductive layer is the N electrode. The barrier height between the P-type semiconductor layer and N-type semiconductor layer and the metal reflective layers are reduced so as to reduce the ohmic contact between the P-type semiconductor layer and N-type semiconductor layer and the metal reflective layers, decrease the work voltage of the LED chip and increase the luminescence efficiency of The LED chip.

Description

technical field [0001] The invention relates to the technical field of LED manufacturing, in particular to an LED chip and a manufacturing method thereof. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a semiconductor solid-state light-emitting device, which is made using the principle of semiconductor PN junction electroluminescence. LED devices have good photoelectric properties such as low turn-on voltage, small size, fast response, good stability, long life, and no pollution. Therefore, they are widely used in outdoor and indoor lighting, backlighting, display, traffic indication and other fields. [0003] Generally speaking, the LED chip structure is divided into three types: horizontal structure (front chip), vertical structure (vertical structure chip) and flip chip structure (flip chip); among them, the P and N electrodes in the flip structure LED chip are located On the same side of the light-emitting area, the light emitted by ...

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Problems solved by technology

However, this may affect other performances of the LED chip, for example, resulting in an increase in the operating voltage of the LED chip

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