Method for rapidly compressing mask and wafer image data on basis of GPU and mesh

An image data and mask technology, applied in image data processing, electrical digital data processing, image enhancement and other directions, to achieve the effect of improving computing efficiency, fast detection speed, and saving computing resources

Active Publication Date: 2016-11-30
江苏维普光电科技有限公司
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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to propose a method for rapidly compressing mask and wafer image data based on GPU and grid, which solves the above existing problems, achieves data compression, and at the same time does not lose small Defect graphics such as scratches and small particles

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  • Method for rapidly compressing mask and wafer image data on basis of GPU and mesh
  • Method for rapidly compressing mask and wafer image data on basis of GPU and mesh
  • Method for rapidly compressing mask and wafer image data on basis of GPU and mesh

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Embodiment Construction

[0026] The present invention will now be described in further detail in conjunction with the accompanying drawings and preferred embodiments. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0027] like figure 1 As shown, an embodiment of a device for extracting grid graphics and filling from vector graphics based on GPU fast calculation includes a control module 5 , a positioning module, a synchronization module 6 , an acquisition module, and a real-time focusing module 8 .

[0028] The control module 5 completes the control of the motion platform (including the setting of the motion track of the motion platform, the setting of the motion speed and acceleration), image collection, rasterization and filling of vector graphics, defect detection, and multiple GPUs can be inserted into the control module Computing...

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Abstract

The invention relates to a method for rapidly compressing mask and wafer image data on the basis of a GPU and a mesh. On the basis of image binaryzation, the method comprises the steps that 1, corresponding hardware resources are distributed for image parallel; 2, a camera is utilized for collecting data to a server, the data is not cached into a magnetic disk, and the data is directly transmitted from the HOST side to the DEVICE side; 3, the image data is filtered in the GPU; 4, binaryzation threshold values are obtained through black-and-white image data in the GPU, then, binaryzation processing is carried out, and finally binary graphic data is obtained; 5, a crossover operation way is adopted, and coordinates of mesh points are compared with coordinates of intersection graphs; 6, an extracted grid matrix is converted into an image with a standard BMP format; 7, the data obtained through parallel meshing is copied from the DEVICE side to the HOST side, and then follow-up data processing is carried out. Hardware computing resources can be effectively saved, computing efficiency is effectively improved, and the detection speed is higher.

Description

technical field [0001] The invention relates to the technical field of semiconductor detection, in particular to a method for rapidly compressing mask plate and wafer image data based on GPU and grid. Background technique [0002] Semiconductor inspection, especially the inspection of masks and wafers, often has a huge amount of inspection data and consumes a lot of computing resources, which will inevitably increase hardware costs. While increasing costs, it also expands the volume of inspection equipment and requires a larger space. space. [0003] The detected image data cannot be simply compressed. The compression only reduces the storage space, but it must be restored during calculation. This only saves storage resources, but for data processing, it wastes more hardware resources. [0004] If the general image compression algorithm is used, it can indeed reduce the amount of calculation data, but some small scratches, small particles and other defects will be ignored, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/50G06T5/00G06T7/00
CPCG06F9/5027G06T5/001G06T7/0004G06T2207/30148
Inventor 刘庄刘建明张彦鹏蒋开
Owner 江苏维普光电科技有限公司
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