Rub screening machine structure for producing wafer cutter raw materials

A raw material and wafer technology, which is applied in the field of wafer knife production, can solve problems such as waste, unguaranteed product metallographic appearance, and large product deformation.

Inactive Publication Date: 2016-12-07
SICHUAN YR NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing disc cutter is difficult to press and form. Because the disc cutter has a large diameter and is very thin, when pressing with pellets, the density of the semi-finished product is poor, the product is not easy to place on the plate, and the metallographic appearance of the product cannot be guaranteed.
If powder is used for pressing, the fluidity of the powder is poor, which will easily lead to uneven pressing and charging, resulting in large deformation of the product after sintering
Therefore, for the production of disc knife in the prior art, its scrap rate is very high, and waste is very big

Method used

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  • Rub screening machine structure for producing wafer cutter raw materials

Examples

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Effect test

Embodiment 1

[0016] Such as figure 1 The structure of a screen cleaning machine for producing disc knife raw materials shown includes a bracket 1, a trough 2 is fixed above the bracket 1, the trough 2 is rectangular, and the surface of the trough 2 is evenly distributed with several diameters of 0.18 mm. The circular through hole 5 of mm, the distance between the centers of circles between two adjacent circular through holes 5 is 1mm; The sliding material pushing block 3 that matches with the material trough 2 is arranged in the described material trough 2, and described sliding material pushing away The width of the block 3 is consistent with the internal width of the chute 2, and the material storage box 7 is fixed on the sliding pushing block 3, the upper part of the storage box 7 is open, and the lower part is welded on the sliding pushing block 3; the chute 2 One end is fixed to the driving device 4, and the driving end 41 of the driving device 4 is connected with the sliding pushing ...

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Abstract

The invention discloses a rub screening machine structure for producing wafer cutter raw materials. The structure comprises a bracket; a groove is fixed above the bracket; multiple circular through holes with diameters of 0.18 mm are uniformly distributed in the surface of the groove; the circle center distances of two adjacent circular through holes are 1 mm; a slide pushing block matched with the groove is arranged in the groove; the width of the slide pushing block is consistent with the internal width of the groove; a storage box is fixed above the slide pushing block; the upper part of the storage box is opened, and the lower part is welded on the slide pushing block; a driving device is fixed at one end of the groove; a driving end of the driving device is connected with the slide pushing block; and a belt conveying belt is arranged below the groove, moves in the long axle direction of the groove, and penetrates from the bottom of the bracket. The rub screening machine structure for producing the wafer cutter raw materials rubs and screens raw materials for pressing wafer cutters to improve the particle sizes of the raw materials so as to guarantee the pressed wafer cutters to have excellent metallographic phases.

Description

technical field [0001] The invention relates to the field of disc knife production, in particular to a structure of a cleaning machine for producing disc knife raw materials. Background technique [0002] Disc knives, also known as disc knives, are often used in grinding, cutting and other work in the mechanical field, and have a wide market. In the existing wafer cutter production process, pellets or powder are used to press into semi-finished wafers, and then sintered at high temperature to achieve consolidation and molding. However, the existing disc cutter is difficult to press and form. Because the disc cutter has a large diameter and is very thin, when pressing with pellets, the density of the semi-finished product is relatively poor, the product is not easy to be placed on the dish, and the metallographic appearance of the product cannot be guaranteed. If powder is used for pressing, the fluidity of the powder is poor, which will easily lead to uneven pressing and ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/00B22F5/00B22F9/04B07B1/04
CPCB07B1/04B22F3/003B22F5/00B22F9/04B22F2009/045B22F2005/001
Inventor 吴承泽阳晓旭
Owner SICHUAN YR NEW MATERIAL TECH
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