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Ternary composite sintering aid for producing and preparing high-heat-conductivity ceramic substrates

A high thermal conductivity ceramic and ternary composite technology, applied in the field of sintering aids, can solve the problems of easy oxidation of ultrafine powder, failure to meet requirements, and high energy consumption, and achieve the goals of reducing energy consumption, high thermal conductivity, and improving production efficiency Effect

Inactive Publication Date: 2016-12-07
南通中兴多元复合钢管有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first way is greatly affected by the powder. Commercial aluminum nitride powder usually cannot meet the requirements, and the ultrafine powder is easy to oxidize and agglomerate; the second way can only sinter aluminum nitride ceramic materials with simple shapes, and consumes a lot of energy. ; It is easy to realize in industry, and it is possible to obtain low-cost and high-performance aluminum nitride ceramic materials

Method used

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Experimental program
Comparison scheme
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Embodiment 1

[0017] The composition of the ternary composite sintering aid used to produce and prepare high thermal conductivity ceramic substrates is Al 2 o 3 , Y 2 o 3 and CaO in a molar ratio of 255:500:84. The sintering temperature is 1580° C., the holding time is 3 hours, and the obtained conductivity is 170 W / m·k.

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PUM

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Abstract

The invention discloses a ternary composite sintering aid for producing and preparing high-heat-conductivity ceramic substrates. The innovation is as follows: the ternary composite sintering aid is prepared from Al2O3, Y2O3 and CaO which are in the mole ratio of 255: 500: 84. By the Al2O3-Y2O3-CaO ternary composite sintering aid disclosed by the invention, high heat conductivity is obtained at a relatively low sintering temperature, the energy consumption is lowered, the production cost is reduced, and the production efficiency is increased.

Description

technical field [0001] The invention relates to a sintering aid, in particular to a composite sintering aid for producing and preparing high thermal conductivity ceramic substrates. Background technique [0002] With the development of modern science and technology, the requirements for materials are increasing day by day. With the increasing complexity and density of components in electronic devices and electronic devices, higher requirements are put forward for ceramic substrates, which are important pillars of integrated circuits. Has good thermal conductivity. For a long time, the substrate material of most high-power hybrid integrated circuits has been using Al 2 o 3 and BeO ceramics. But Al 2 o 3 The thermal conductivity of ceramics is low, and the thermal expansion coefficient does not match Si; although BeO ceramics have excellent comprehensive properties, their high production costs and high toxicity seriously restrict their application and promotion. Therefor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/63C04B35/581
CPCC04B35/6303C04B35/581C04B2235/9607
Inventor 宗亚娟
Owner 南通中兴多元复合钢管有限公司