Temporary bonding processing method of sheet workpiece

Abstract

The invention discloses a temporary bonding processing method of a sheet workpiece. The method is characterized by comprising the following steps of (1) selecting a support plate and arranging an isolating membrane on the front surface of the support plate; (2) coating the isolating membrane with a layer of bonding glue; (3) attaching a to-be-processed workpiece to the bonding glue; (4) processing the workpiece with the support plate; (5) inverting the processed workpiece on a bearing part; (6) bending the support plate, making a random edge of the support plate form a warped edge and tearing at the warped edge until the support plate is stripped; and (7) bending the isolating membrane, making the random edge of the isolating membrane form the warped edge and tearing at the warped edge until the isolating membrane is stripped. By the temporary bonding processing method of the sheet workpiece, processing of the workpiece can be finished without special bonding or de-bonding equipment, so that the processing procedure is simple, the production efficiency is high, and the processing cost and the equipment investment cost are low.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a processing method for temporary bonding of sheet-shaped workpieces. Background technique [0002] Thin slice workpiece—taking wafer as an example, it needs to attach or bond the wafer to a thick carrier during the processing, so as to facilitate the subsequent processing of wafer thinning and other processes. However, existing wafers in the industry The best way is to bond the wafer and the carrier with the bonding glue first, then thin the wafer, and finally debond the processed wafer and the carrier. Of course, the remaining bonding glue needs to be processed. clean. In the above-mentioned existing process, no matter it is the bonding process or the debonding process, special equipment is required, such as the wafer vacuum bonding machine and bonding method with the patent application number 201410570392.5, and the wafer vacuum bonding machine with the patent applic...

AI Technical Summary

Problems solved by technology

Therefore, the processing cost is high, and the equipment cost invested in the early stage is large.

In addition, during the use of the above-mentioned special equipment, its clamping and unloading process and the pretreatment process before the wafer is placed in the special equipment will cause the wafer processing process to be complicated and the production efficiency to be low, thus increasing the processing cost

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