Adhesive for electronic ceramic formation and preparation method thereof

An electronic ceramics and adhesive technology, applied in the field of electronic ceramics molding adhesives and their preparation, can solve the problems of poor stability, poor elasticity, inconvenient use, etc., and achieve excellent pressure resistance, excellent viscoelasticity, good The effect of stability

Inactive Publication Date: 2017-01-04
ZHANGJIAGANG HONGJIA DIGITAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: In order to solve the problem that the existing adhesive slurry used for molding electronic ceramic products has poor stability, poor elasticity, and inconvenient use, which lead to the limitation of its wide use, the present invention provides an electronic An adhesive for ceramic molding and a preparation method thereof, the adhesive slurry has good stability, and the viscoelasticity of the slurry is excellent, and can be widely used in electronic ceramic products, and the prepared electronic ceramic has high dielectric strength Constant, good stability, and excellent withstand voltage characteristics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A binder for forming electronic ceramics, composed of the following components by mass percentage: diatomite: 9%, silane coupling agent: 3%, polyvinyl butyral: 9%, sodium aluminate: 5% , ethyl acetate: 7%, isopropanol: 13%, and the balance is epoxy resin.

[0016] A preparation method of an adhesive for forming electronic ceramics, comprising the steps of:

[0017] Step 1: Weigh the following components according to mass percentage: diatomaceous earth, silane coupling agent, polyvinyl butyral, sodium aluminate, ethyl acetate, isopropanol and epoxy resin;

[0018] Step 2: Put the raw materials weighed in step 1 into a ball milling tank, process them with a ball milling process, and use zirconia balls as the ball milling medium to obtain a mixed colloid;

[0019] Step 3: Separate the zirconia balls from the mixed colloid obtained in step 2, then pour the mixed colloid into a container, let it stand still, and defoam to obtain the adhesive.

Embodiment 2

[0021] A binder for forming electronic ceramics, composed of the following components by mass percentage: diatomite: 8%, silane coupling agent: 2%, polyvinyl butyral: 8%, sodium aluminate: 4% , ethyl acetate: 6%, isopropanol: 13%, and the balance is epoxy resin.

[0022] A preparation method of an adhesive for forming electronic ceramics, comprising the steps of:

[0023] Step 1: Weigh the following components according to mass percentage: diatomaceous earth, silane coupling agent, polyvinyl butyral, sodium aluminate, ethyl acetate, isopropanol and epoxy resin;

[0024] Step 2: Put the raw materials weighed in step 1 into a ball milling tank, process them with a ball milling process, and use zirconia balls as the ball milling medium to obtain a mixed colloid;

[0025] Step 3: Separate the zirconia balls from the mixed colloid obtained in step 2, then pour the mixed colloid into a container, let it stand still, and defoam to obtain the adhesive.

Embodiment 3

[0027] A binder for forming electronic ceramics, composed of the following components by mass percentage: diatomite: 10%, silane coupling agent: 4%, polyvinyl butyral: 11%, sodium aluminate: 8% , ethyl acetate: 8%, isopropanol: 19%, and the balance is epoxy resin.

[0028] A preparation method of an adhesive for forming electronic ceramics, comprising the steps of:

[0029] Step 1: Weigh the following components according to mass percentage: diatomaceous earth, silane coupling agent, polyvinyl butyral, sodium aluminate, ethyl acetate, isopropanol and epoxy resin;

[0030] Step 2: Put the raw materials weighed in step 1 into a ball milling tank, process them with a ball milling process, and use zirconia balls as the ball milling medium to obtain a mixed colloid;

[0031] Step 3: Separate the zirconia balls from the mixed colloid obtained in step 2, then pour the mixed colloid into a container, let it stand still, and defoam to obtain the adhesive.

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PUM

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Abstract

The invention relates to the technical field of electronic devices, particularly an adhesive for electronic ceramic formation. The adhesive for electronic ceramic formation is composed of the following components in percentage by mass: 8-10% of diatomite, 2-4% of silane coupling agent, 8-11% of polyvinyl butyral, 4-8% of sodium aluminate, 6-8% of ethyl acetate, 13-19% of isopropanol and the balance of epoxy resin. The adhesive slurry has the advantages of favorable stability and excellent viscoelasticity, and can be widely used in electronic ceramic products. The prepared electronic ceramic has the advantages of higher dielectric constant, favorable stability and excellent voltage resistance.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to an adhesive for molding electronic ceramics and a preparation method thereof. Background technique [0002] Electronic ceramics refer to ceramic materials with stable mechanical properties, good corrosion resistance and aging properties, especially ceramic materials that can be used in electronics, communications, automobiles, machinery, textiles and other industries because of their excellent electrical properties. For example, piezoelectric materials can generate electric fields due to mechanical deformation, and can also generate mechanical deformation due to the action of electric fields. This inherent electromechanical coupling effect makes piezoelectric materials widely used in engineering, such as drives, energy converters, sensors, frequency control devices, etc., and the new generation of piezoelectric materials also has conditioned reflection and The abili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/63
Inventor 徐靖赵维达徐丹范佳晨徐凯
Owner ZHANGJIAGANG HONGJIA DIGITAL TECH
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