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Electroplating method for circuit board

A circuit board and electroplating copper technology, which is applied in jewelry and other fields, can solve problems such as board deformation, insufficient clip force, thin plate falling off, etc., and achieve the effect of orderly crystal arrangement, more crystal arrangement and uniform surface

Inactive Publication Date: 2017-01-04
SHENZHEN TONGXIN CIRCUIT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) The clips on the flying target are usually used to clamp thick plates. For thin plates, the clips are not strong enough, and it is easy to make the thin plates fall off. The clips fall into the potion tank, and it is impossible to prepare thin plates (circuit boards with a thickness of 0.1mm-0.2mm)
[0006] 2) The clip on the flying target only clamps the technical edge of one side of the board. Due to the insufficient mechanical willfulness of the thin board, the board is broken and deformed under the force of pumping and swinging, and it is scrapped due to mechanical damage.
[0007] 3) The etching machine cannot drive the thin plate forward

Method used

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Examples

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Effect test

Embodiment Construction

[0031] Below in conjunction with specific embodiment, further illustrate the present invention.

[0032] A circuit board electroplating method, is characterized in that, comprises the following steps:

[0033] Step 1, cleaning, clean the oil on the surface of the drilled substrate,

[0034] First rinse with water, use deionized water to circulate and rinse, and then degrease and wash at 40°C for 15 minutes;

[0035] Step 2, micro-etching, using alkaline and acidic micro-etching solutions for micro-etching treatment

[0036] The circuit board cleaned in step 1 is subjected to micro-etching treatment in alkaline micro-etching solution for 4-6 minutes at a temperature of 35 °C, and then rinsed with deionized water for 6-10 minutes, and the washing water pressure is 0.9Kg / cm 2 , and then use acidic microetching solution to perform microetching treatment at 40°C for 5-7min, so that the roughness Ra of the circuit board after microetching is between 0.45-0.5um;

[0037] Step 3, w...

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PUM

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Abstract

The invention relates to an electroplating method for a circuit board. The electroplating method is characterized by comprising the following steps: cleaning; microetching; washing; and electrocoppering. The method is especially effective in preparation of a thin plate with a circuit board thickness of 0.1 to 0.2 mm and a thin plate with a drill hole diameter of 0.15 mm, and the fault rate of the thin plate is 0.

Description

technical field [0001] The patent of the present invention relates to a circuit board electroplating method. Background technique [0002] Hole copper electroplating needs to clamp the process edge of the board with clips on the flying target, through the guidance of the current, in the chemical potion, in the environment of pumping (to ensure the uniformity of the potion) and swinging (to ensure the penetration of the potion), Electroplate 9-15um copper in the hole to meet the requirements of interlayer conduction. The ordinary board is driven forward by the roller of the etching machine, and the etching liquid is sprayed through the nozzle to etch away the unnecessary copper to complete the production of the circuit. [0003] The thickness of ordinary boards is 1.0mm-2.0mm, which is 10 times to 20 times that of such ultra-thin boards. This kind of high-precision ultra-thin boards are mostly used in handwritten electronic products, which usually require high transmission s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D3/38
Inventor 阙民辉杨志勇
Owner SHENZHEN TONGXIN CIRCUIT ELECTRONICS
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