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Method for filling dense film defects

A dense film and defect technology, which is applied in the field of dense film defect filling, can solve the problems of affecting the performance of palladium film, complicated operation, and adding organic matter removal steps, etc., and achieves the benefits of recycling, good repeatability, and improved leveling performance Effect

Active Publication Date: 2017-01-11
DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The introduction of organic matter in this method will affect the performance of the palladium membrane, and the removal step of organic matter is added, and the operation is more complicated

Method used

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  • Method for filling dense film defects
  • Method for filling dense film defects

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Experimental program
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Effect test

Embodiment 1

[0019] Three kinds of Al with an average particle size of 0.5 μm, 0.3 μm and 0.2 μm 2 o 3 particles and 20nm TiO 2 In order to fill the particles into a suspension in deionized water, add high-temperature glue to prepare a composite modification solution A, in which each particle size Al 2 o 3 The mass volume concentration is 1g / mL, TiO 2 The mass volume concentration of the high-temperature glue (specifically: sodium silicate) is 10 g / mL. Use the prepared defect modification solution to modify the defects of the palladium membrane (length 80mm, outer diameter 12.5mm) prepared by conventional electroless plating. The pressure difference between the inner and outer sides of the dense membrane is 0.80-0.99MPa (the modified dense membrane is a tubular membrane , the ceramic particles or high-temperature glue in the defect filling solution are introduced into the defects on the surface of the film from the outside of the dense film by negative pressure method), the residence t...

Embodiment 2

[0022] Three kinds of Al with average particle size of 0.5 μm, 0.3 μm and 0.2 μm 2 o 3 particles and 20nm TiO 2 Add in deionized water to make a suspension, add high-temperature glue to prepare defect modification solution A, wherein each particle size Al 2 o 3 The mass volume concentration is 1g / mL, TiO 2The mass volume concentration of the high-temperature glue (specifically: sodium silicate) is 10 g / mL. Use the prepared defect modification solution to modify the defects of the palladium alloy film (length 80mm, outer diameter 12.5mm) prepared by conventional electroless plating (the modified dense film is a tubular film, and the ceramic particles in the defect filling solution are filled by negative pressure method) Or high-temperature glue is introduced from the outside of the dense film into the defect on the surface of the film), the pressure difference on both sides of the dense film is 0.80-0.99MPa, the residence time of the dense film in the defect modification so...

Embodiment 3

[0026] Three kinds of Al with average particle size of 0.5 μm, 0.3 μm and 0.2 μm 2 o 3 particles and 20nm TiO 2 In order to fill the particles into a suspension in deionized water, add high-temperature glue to prepare a defect modification solution A, in which each particle size Al 2 o 3 The mass volume concentration is 1g / mL, TiO 2 The mass volume concentration of the high-temperature glue (specifically: sodium silicate) is 20 g / mL. Use the prepared defect filling solution to fill the defects of the palladium film (length 80 mm, outer diameter 12.5 mm) prepared by conventional electroless plating (the modified dense film is a tubular film, and the ceramic particles in the defect filling solution or The high temperature glue is introduced from the outside of the dense film into the defect on the surface of the film), the negative pressure method condition is to keep the pressure difference between the two sides of the dense film at 0.80-0.99MPa, the time for the dense film...

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Abstract

High temperature glue and ceramic particles with certain particle size distribution are mixed to prepare a compound modification liquid to realize the full range (from a few nanometers to hundreds of microns) modification of defects on a dense film. The ceramic particles are used to modify large defects (such as more than 5nm) on the dense film, the high temperature glue is used to modify small defects (such as less than 5nm) on the dense film; in addition, by the use of the high temperature adhesive, the leveling performance of the compound modification liquid can be significantly improved, the ceramic particles can be bonded and toughened, and after-processing temperature is reduced. The compound modification liquid is used for coating and modifying the surface of the dense film with the defects, and the ceramic particles and the high temperature glue only fill defect parts and are not adsorbed on the surface of the dense film. The method can realize a defect filling ratio of nearly 100%, has the advantages of simple process and good repeatability, and is suitable for large-scale filling of the defects on the dense film.

Description

technical field [0001] The invention relates to a filling technology for dense film defects. Ceramic oxide particles fill large defects, and high-temperature glue fills small defects. In addition, high-temperature glue as an additive can improve the leveling performance of oxide particle suspensions and play a role in controlling the oxide particles. The purpose of bonding and toughening. Background technique [0002] As an emerging high-efficiency separation technology, membrane separation is playing an increasingly important role in the fields of energy, chemical industry, medicine, environment, and metallurgy. Usually, functional materials are loaded on the surface of porous supports to obtain supported membrane separation materials, which can be divided into two categories: porous membranes and dense membranes, among which porous membranes include polymer porous membranes and microporous silica membranes, etc., and dense membranes Including palladium and palladium compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D67/00
Inventor 郑磊李慧徐恒泳
Owner DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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