Speed grading optimization structure and method capable of improving yield of high-performance integrated circuit

Abstract

The invention relates to a speed grading optimization structure and method capable of improving the yield of high-performance integrated circuits. The structure is embedded in an integrated circuit and is characterized in that an integrated circuit chip comprises N critical paths, i.e., critical path A, critical path B...critical path N, which jointly form a critical path set [A, B...N], the time delay of the N paths decides the speed grading of the integrated circuit. The adopted method comprises the following steps of: 1. selecting critical paths; 2. inserting an integrated circuit speed grading optimization structure; 3. testing an integrated circuit chip at a frequency boundary Fi; 4) obtaining an original speed grading result; 5. performing speed grading optimization; 6. testing again at the frequency boundary Fi; 7. re-dividing the speed grade of the integrated circuit chip; 8. deciding the speed grade and calculating a speed grading optimization rate; 9. marking the speed grade and working frequency of the integrated chip.

Description

technical field [0001] The present invention relates to an integrated circuit chip speed classification optimization structure and optimization method, more precisely, it is a speed classification optimization structure suitable for improving the output of high-performance integrated circuit chips in the process of integrated circuit chip speed classification and its implementation optimized method. Background technique [0002] An integrated circuit (integrated circuit) is a tiny electronic device or component. It is a semiconductor manufacturing process such as oxidation, photolithography, diffusion, epitaxy, aluminum evaporation, etc., which integrates semiconductors, resistors, capacitors and other components required to form a circuit with certain functions and the connecting wires between them into a small piece of silicon. On-chip, and then welded electronic devices packaged in a tube; all the components have been structurally integrated, making electronic components...

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