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Mass production method of high frequency inductors

A technology for mass production of inductors, applied in the field of inductors, can solve problems such as unfavorable inductor operation, unfavorable circuit board layout, and cumbersome problems

Active Publication Date: 2018-05-18
SIWARD CRYSTAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] As far as the process is concerned, the inner winding coil needs to go through four through-hole procedures, four procedures for filling conductive paste, and four procedures for coating conductive paste to form circuit patterns 112, 122, 132, 142. 13 procedures, including the sintering treatment of step (E), although the procedure of the previous case 2 is slightly simpler than the previous case 1; however, the total procedure of the previous case 2 is as many as 13, which is quite cumbersome. Leading to an increase in the time and cost of manufacturing
As far as the practical application is concerned, since the laminated body 10 is obtained by stacking and sintering the circuit ceramic mother sheets 110, 120, 130, 140 and then scribing, the volume of the laminated inductor 1 also increases with the improve the layout to the detriment of the arrangement onto the circuit board
In addition, since the inner wound coil is composed of the circuit patterns 112, 122, 132, 142 of the circuit ceramic sheets 11, 12, 13, 14, the discontinuous interfaces between the circuit patterns 112, 122, 132, 142 It is easy to produce non-ohmic contact or increase impedance to generate additional electrothermal effect (Joule-heating), which is not conducive to the operation of inductors

Method used

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  • Mass production method of high frequency inductors
  • Mass production method of high frequency inductors
  • Mass production method of high frequency inductors

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Embodiment Construction

[0066] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

[0067] refer to Figure 8 , a first embodiment of the high frequency inductor 2 of the present invention includes a main body 21 and a first coil 23 .

[0068] The main body 21 has a contour surface 210 , and the contour surface 210 of the main body 21 includes a first side edge 211 and a second side edge 212 oppositely disposed. The main body 21 is made of a non-magnetic material and is integrated.

[0069] The first coil 23 is disposed on the main body 21 and includes a plurality of top segments 231 , a plurality of vertical segments 232 , and a plurality of bottom segments 233 . The top section 231 , the vertical section 232 and the bottom section 233 are arranged at intervals along a first direction X from the first side edge 211 toward the second side edge 212 of the main body 21 . The top section 231 and...

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Abstract

A high frequency inductor chip includes a core and a coil. The core is in the form of a single piece of a non-magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. A method for making the high frequency inductor chip is also disclosed.

Description

technical field [0001] The invention relates to an inductor, in particular to a high-frequency inductor and a mass production method thereof. Background technique [0002] Inductors currently on the market can be mainly divided into thin film, multilayer and wire wound. A laminated inductor (not shown) as disclosed in the Taiwan Patent of Invention No. TWI430300 certificate (hereinafter referred to as the previous case 1), which includes a plurality of insulating layers and a plurality of coil pattern layers, and the insulating layer The coil pattern layers are stacked alternately with each other, and a main body and a coil of the laminated inductor are respectively defined by the insulating layer and the coil pattern layer stacked with each other. [0003] In detail, in the multilayer inductor of the previous case 1, each coil pattern layer is correspondingly plated on each insulating layer; wherein, each coil pattern layer plated on each insulating layer only surrounds th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/30H01F27/32H01F19/04H01F41/00
CPCH01F41/042H01F17/0006H01F2017/004
Inventor 萧铭河李邦彦曾彦豪
Owner SIWARD CRYSTAL TECH
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