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Aligning method and aligning device for LDI (Laser Direct Image) outer layer

A technology of alignment device and outer layer, which is applied in optics, instruments, photoplate making process of pattern surface, etc., can solve the problems of low alignment accuracy and complicated operation of LDI outer layer, and achieve easy operation, simple and accurate method high degree of effect

Active Publication Date: 2017-01-25
TIANJIN JINXIN MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a method and device for alignment of the outer layer of LDI to solve the technical problems of low alignment accuracy and complicated operation of the outer layer of LDI existing in the prior art

Method used

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  • Aligning method and aligning device for LDI (Laser Direct Image) outer layer
  • Aligning method and aligning device for LDI (Laser Direct Image) outer layer
  • Aligning method and aligning device for LDI (Laser Direct Image) outer layer

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Embodiment 1

[0044] Such as figure 1 As shown, the embodiment of the present invention provides an LDI outer layer alignment method, comprising the following steps:

[0045] S1. Obtain the actual coordinates of at least two alignment holes of the PCB placed on the workbench.

[0046] Place the PCB board on the workbench, then fix one corner of the PCB board through the locator, and then collect the coordinates of the positioning holes of the PCB board through the CCD, and there are at least two positioning holes.

[0047] S2. Obtain the drawing coordinates of the alignment holes corresponding to the actual alignment holes in the electronic drawing.

[0048] Obtain the coordinates of the two positioning holes corresponding to the actual PCB board in the CAM drawing, that is, obtain the coordinates of the alignment hole drawing.

[0049] S3. Calculating the correction parameters of the electronic drawing based on the actual coordinates of the alignment holes and the drawing coordinates of ...

Embodiment 2

[0101] Such as Figure 4 As shown, the embodiment of the present invention provides a kind of LDI outer layer aligning device, comprises the actual coordinate acquisition module 3 of the aligning hole, is used to acquire the actual coordinate of the aligning hole of the PCB board placed on the workbench; The acquisition module 4 is used to obtain the alignment hole drawing coordinates corresponding to the actual alignment holes in the electronic drawing; the correction displacement calculation module 5 is used to calculate the correction parameters of the electronic drawing through the actual coordinates of the alignment holes and the alignment hole drawing coordinates , correct the electronic drawing according to the correction parameters; the PCB board inversion module 6 is used to invert the PCB board.

[0102] The device can obtain the actual coordinates of the alignment hole of the PCB board and the coordinates of the electronic alignment hole drawing, and calculate the c...

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Abstract

The invention provides an aligning method and an aligning device for an LDI (Laser Direct Image) outer layer and relates to the technical field of lithography direct writing exposure machines and projection display. The aligning method for the LDI outer layer comprises the following steps of acquiring actual coordinates of at least two aligning holes of a PCB (Printed Circuit Board) arranged on a worktable; acquiring aligning hole drawing coordinates corresponding to actual aligning holes in an electronic drawing; calculating correction parameters of the electronic drawing according to the actual coordinates of the aligning holes and the aligning hole drawing coordinates, and correcting the electronic drawing according to the correction parameters; reversely rotating the PCB, and repeatedly executing the above steps. The technical problems that the LDI outer layer is low in aligning precision and is complex in operation existing in the prior art are solved, and technical effects that the aligning method is simple and is higher in precision are realized.

Description

technical field [0001] The invention relates to the technical field of photolithography direct writing exposure machine and projection display, in particular to a method and device for aligning the outer layer of LDI. Background technique [0002] Photolithography is the technique used to print a pattern of features on the surface of a substrate. Such substrates can be used in the manufacture of semiconductor devices, various integrated circuits, flat panel displays (such as liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. [0003] In the lithography device of the direct-write lithography machine, the feature pattern is generated by the micromirror array of the spatial light modulator. These tiny mirrors can be independently addressed and individually controlled to reflect the irradiated beam in different oblique directions to produce spatial light intensity. Finally, the characteristic graphic...

Claims

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Application Information

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IPC IPC(8): G03F9/00
CPCG03F9/7019G03F9/7088
Inventor 刘洋
Owner TIANJIN JINXIN MICROELECTRONICS TECH CO LTD