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Method for micro anchor leg torsion bonding strength by using thermal driving

A technology of torsional bonding and anchoring legs, applied in the direction of applying stable tension/pressure to test the strength of materials, etc., can solve problems such as affecting the measurement results

Inactive Publication Date: 2017-02-01
PEKING UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

However, due to the displacement load applied by the probe station probe in the process of this method, the deviation of the applied direction cannot be avoided, which will affect the measurement results to a certain extent

Method used

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  • Method for micro anchor leg torsion bonding strength by using thermal driving
  • Method for micro anchor leg torsion bonding strength by using thermal driving
  • Method for micro anchor leg torsion bonding strength by using thermal driving

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Embodiment Construction

[0020] The invention proposes a method for detecting the torsional bonding strength of micro-anchor legs. The following describes how to use this method to detect the torsional bonding strength of micro-anchor legs after anodic bonding in combination with Peking University's standard bonding deep etching release process. The main steps are as follows:

[0021] (1) Process tape-out. The process used is the bonded deep etch release standard process, such as image 3 As shown, it mainly includes:

[0022] (a) ASE etches the silicon wafer to a depth of 4 μm, and engraves the steps of the anchor legs to form the anchor legs;

[0023] (b) Glass sheet preparation (B33 or 7740 glass)

[0024] (c) Anodic bonding of silicon wafers and glass wafers;

[0025] (d) KOH thins the silicon surface, and the remaining thickness is 75±5μm;

[0026] (e) ASE silicon wafer, the structure is released, obtained as figure 1 In the on-chip detection structure described in , the dark part is the an...

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Abstract

The present invention discloses a method for the micro anchor leg torsion bonding strength by using thermal driving, wherein a moment-of-couple capable of making a micro anchor leg to produce torsion is achieved through the thermal driving structure in a newly-designed on-chip detection structure so as to make the anchor leg be broken, and the driving displacement during the breaking is recorded and the torsion bonding strength value is calculated. With the method of the present invention, the monitoring and the evaluating of the bonding process can be performed, and the mechanical reliability of the device can be predicted. The method of the present invention has advantages of self-positioning capability, self force testing capability, simpleness, and no requirement of large-scale high-precision instruments.

Description

technical field [0001] The invention belongs to the field of micro-electro-mechanical system (MEMS) process quality monitoring and reliability testing, and relates to a method for online extraction of bonding strength using a V-shaped thermal drive structure, especially for quantitative extraction and prediction of torsional bonding strength of micro-anchor legs The field of device mechanical reliability. Background technique [0002] Since the 1990s, microelectromechanical systems (MEMS) technology has entered a stage of rapid development, not only because of the novel concept, but also because MEMS devices have the prospect of miniaturization, integration and better performance compared with traditional devices. Now MEMS has been widely used in automobiles, aerospace, information control, medicine, biology and other fields. [0003] For MEMS devices manufactured using bulk silicon MEMS technology, most of the mechanical structures are fixed by bonding the anchor leg struc...

Claims

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Application Information

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IPC IPC(8): G01N3/08
Inventor 何军张大成张立杨芳刘鹏王玮李婷罗葵田大宇
Owner PEKING UNIV