Bending mechanism for chip diode and work method of bending mechanism
A bending mechanism and diode technology, applied in the field of bending dies, can solve the problems of product structural strength, electrical performance impact, product quality impact, pin surface wear, etc., to achieve a high degree of automation, reduce labor intensity, and avoid wear and tear. Effect
Active Publication Date: 2017-02-15
YANGZHOU YANGJIE ELECTRONIC TECH CO LTD
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Problems solved by technology
In this regard, in the prior art, two sets of molds need to be used for bending separately, and the manual transfer between the two sets of molds is not only laborious, but also difficult to process due to two sets of assembly and positioning. Defects such as poor precision have a serious impact on the final product quality
[0003] In addition, people also found in the actual processing that the existing molds will bring great wear to the surface of the pins after bending, especially after the multiple bending molds are worn, thus affecting the structural strength of the final product. , electrical performance and other aspects have a great impact
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[0038] The present invention as Figure 1-12 As shown, it includes an upper mold assembly 1, a middle mold assembly 2, a lower mold assembly 3, a top plate 4, a bottom plate 5 and at least one guide post 6, the top plate 4 and the bottom plate 5 are arranged in parallel, and the guide post 6 is fixed Connected between the top plate 4 and the bottom plate 6;
[0039] The middle mold assembly 2 includes a middle mold drive assembly 21 and a middle mold 22, the middle mold 22 is used to clamp the chip diode 7, and the middle mold driving mechanism 21 is connected between the middle mold 22 and the bottom plate 5 During the bending process, the middle mold 22 is driven by the middle mold drive assembly 21 to do a linear lifting movement; so that the SMD diode only needs to be positioned and clamped once during the whole bending process, effectively avoiding problems caused by transshipment and multiple times. The defects of large processing error and low processing efficiency cau...
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The invention discloses a bending mechanism for a chip diode and a work method of the bending mechanism and relates to the field of bending dies. The bending mechanism for the chip diode and the work method of the bending mechanism are provided, wherein the bending mechanism is exquisite in structure, convenient to use, high in automation degree and high in machining precision, efficient machining can be maintained in the use process, and meanwhile the surface of a pin is effectively prevented from being damaged. An upper die assembly comprises an upper die plate, an upper die plate driving assembly, a pair of upper dies and a pair of upper die driving assemblies. The upper die plate is connected with guide pillars in a sleeving manner. The top ends of the upper dies stretch to the part above the upper die plate. The upper die driving assemblies are fixedly connected to the top face of the upper die plate and are used for driving the upper dies to conduct the linear reciprocating movement. Pressing wheels are hinged to the bottom ends of the upper dies. The bending mechanism for the chip diode and the work method of the bending mechanism overall have the beneficial effects that use is convenient, the automation degree is high, the machining precision is high, the machining efficiency is high, and the rejection rate is low.
Description
technical field [0001] The invention relates to the field of bending dies. Background technique [0002] At present, the pins of the SMD diode are bent twice in the same direction at 90° after cutting to form a C-shaped frame, such as Figure 4 shown. In this regard, in the prior art, two sets of molds need to be used for bending separately, and the manual transfer between the two sets of molds is not only laborious, but also difficult to process due to two sets of assembly and positioning. Defects such as poor precision have a serious impact on the final product quality. [0003] In addition, people also found in the actual processing that the existing molds will bring great wear to the surface of the pins after bending, especially after the multiple bending molds are worn, thus affecting the structural strength of the final product. , Electrical performance and other aspects have a great impact. Contents of the invention [0004] Aiming at the above problems, the pres...
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IPC IPC(8): B21F1/00
CPCB21F1/004
Inventor 王双王毅
Owner YANGZHOU YANGJIE ELECTRONIC TECH CO LTD