Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lifting regulation type heat dissipation base of intelligent notebook computer

A notebook computer, lift adjustment technology, applied in the direction of electrical digital data processing, instruments, digital data processing parts, etc., can solve the problems of inconvenient angle of notebook radiator, poor adjustment and heat dissipation effect, etc., to achieve good heat dissipation effect and easy adjustment. , the effect of improving work performance

Inactive Publication Date: 2017-02-15
CHENGDU YIRUIXIN TECH CO LTD
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the angle of the existing notebook radiator is inconvenient to adjust and the heat dissipation effect is poor. The present invention provides a heat dissipation base for a lifting adjustable intelligent notebook

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lifting regulation type heat dissipation base of intelligent notebook computer
  • Lifting regulation type heat dissipation base of intelligent notebook computer
  • Lifting regulation type heat dissipation base of intelligent notebook computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Such as Figures 1 to 3 As shown, the present embodiment provides a heat dissipation base for a lift-adjustable smart notebook computer, which is characterized in that it includes a bottom substrate 1 and a placement plate 5, the bottom substrate 1 is a Fangxing board arranged horizontally, and the upper surface of the bottom substrate 1 has two left and right sides. The ends are respectively provided with a lifting mechanism 2 and an eccentric wheel mechanism 4. The lifting mechanism 2 is a secondary lifting sleeve mechanism. The top of the lifting mechanism 2 is connected with the placement plate 5 through a hinge mechanism. Seat 4-1, the left side of mounting seat 4-1 is vertically provided with support rod A4-5 and support rod B4-4, and the top of support rod A4-5 and support rod B4-4 is provided with an eccentric wheel driven by motor 4-2 4-3, the eccentric wheel 4-3 is in contact with the lower surface of the lifting mechanism 2 .

[0018] This embodiment is simp...

Embodiment 2

[0020] This embodiment is further optimized on the basis of embodiment 1, specifically:

[0021] The placement plate 5 is provided with a fan installation area one 5-1, a fan installation area two 5-2 and a cooling hole area 5-3, a fan installation area one 5-1 and a fan installation area two 5-2 rectangular areas, The first fan installation area 5-1 and the second fan installation area 5-2 are provided with a plurality of strip-shaped holes, and the cooling hole area 5-3 is evenly distributed with a plurality of square through holes, and the lower surface of the placement plate 5 is provided with The heat dissipation fan group A3-1 and the heat dissipation fan group B3-2 correspond one-to-one to the fan installation area 1 5-1 and the fan installation area 2 5-2.

[0022] The placing plate 5 can rotate 0°~180° around the hinge mechanism.

[0023] The lower end of the placement plate 5 is provided with two storage grooves 5-4, and the storage groove 5-4 is provided with a baf...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a lifting regulation type heat dissipation base of an intelligent notebook computer, and relates to the technical field of a heat dissipation base. The lifting regulation type heat dissipation base of the intelligent notebook computer comprises a bottom substrate and a placement plate; the bottom substrate is a square plate arranged horizontally; a lifting mechanism and an eccentric wheel mechanism are respectively arranged at both left and right ends of the upper surface of the bottom substrate; the lifting mechanism is a two-stage lifting sleeve mechanism; the top of the lifting mechanism is connected with the placement plate by a articulated mechanism; the eccentric wheel mechanism comprises a mounting base mounted on the bottom substrate; a bracing piece A and a bracing piece B are vertically arranged on the left side of the mounting base; eccentric wheels driven by a motor are arranged at the tops of the bracing piece A and the bracing piece B; and the eccentric wheels are in contact with the lower surface of the lifting mechanism. The lifting regulation type heat dissipation base of the intelligent notebook computer has the advantages of simple structure, efficient heat dissipation and adjustable angle and height.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment, and more specifically relates to a heat dissipation base for a lift-adjustable smart notebook computer. Background technique [0002] Notebook computer is a kind of computer tool that people generally use at present. In today's life, notebook computers are indispensable electronic products for most people, but the heat dissipation problem of notebook computers has also become the biggest problem for users. A large number of integrated circuits are used in notebooks, but high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. Existing notebooks only have a heat sink with a built-in fan for heat dissipation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/20
CPCG06F1/203
Inventor 昌越彬蒋明睿
Owner CHENGDU YIRUIXIN TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products